中國有色金屬學(xué)報(bào)(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 33 No. 6 June 2023 |
（1. Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China;
2. Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China;
3. School of Engineering, Westlake University, Hangzhou 310024, China）
Abstract:In order to determine the effect of Sb element on the welding reliability of Sn-Sb alloy solder, the interfacial behavior of Sn-Sb alloys with different Sb contents on the Cu substrate was investigated. The evolution process of interfacial layers was explained by analyzing the microstructure and interfacial reaction thermodynamics of Sn-xSb/Cu system. The addition of Sb has a non-monotonic effect on the intermetallic compound layers. Sb can inhibit the diffusion of Cu into solder. The addition of 3 wt.% Sb in the alloy reduces the activation energy of interfacial reaction from 286.41 to 62 kJ/mol, which promotes the interfacial reaction. The addition of 10 wt.% Sb increases the activation energy of interfacial reaction to 686.73 kJ/mol, which inhibits the interfacial reaction and reduces the erosion of the Cu substrate by the solder and inhibits the formation of an excessively thick interfacial layer.
Key words: Sn-xSb alloy; interface layer; interface reaction; thermodynamics; solder
