(1. 重慶理工大學 重慶特種焊接材料與技術(shù)高校工程技術(shù)研究中心，重慶 400054；
2. 金龍精密銅管集團股份有限公司，重慶 404000；
3. 華中科技大學 材料科學與工程學院，武漢 430074)
摘 要: 全金屬間化合物焊點具有“低溫制備，高溫服役”技術(shù)優(yōu)勢，成為最可能替代用于高溫環(huán)境的高鉛焊料、Au基焊料等連接材料。本文概述了低溫燒結(jié)、固液互擴散鍵合技術(shù)、瞬態(tài)液相連接等方法制備全金屬間化合物(IMC)焊點的特點，綜述了Cu/Sn、Cu/In、Sn/Ag、Sn/Ni等體系制備全IMC焊點的研究進展，指出鍵合時間太長、相變會產(chǎn)生孔洞等缺陷是制約IMC生產(chǎn)應(yīng)用的主要問題，認為應(yīng)結(jié)合Cu-Cu接頭的結(jié)構(gòu)特點和材料性能，在焊料體系方面開發(fā)更多基于Sn基、Cu基、Sn-Cu基二元或三元焊料體系，更多地關(guān)注焊料的狀態(tài)、尺寸、制備方法；在制備方法方面，把母材和焊料構(gòu)造為一個冷熱微循環(huán)，對焊料進行如飛秒激光、局部激光、感應(yīng)加熱等瞬態(tài)、局部高功率加熱，同時對母材進行高功率制冷，適當輔助振動和壓力能增加碰撞擴散幾率和縮短擴散距離，就能快速獲得單一高可靠性全IMC焊點。
關(guān)鍵字: 全金屬間化合物；高溫焊料；制備方法；焊料體系；冷熱微循環(huán)
（1. Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology, Chongqing University of Technology, Chongqing 400054, China;
2. Golden Dragon Precise Copper Tube Group Inc, Chongqing 404000, China;
3. School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China）
Abstract:Full intermetallic compound solder joints have become the most alternative to high lead solder, Au based solder and other connecting materials utilized in high temperature environment since they can be prepared at low temperature and serve at high temperature. The characteristics of full IMC prepared by low temperature sintering, solid-liquid interdiffusion bonding and transient liquid phase method were summarized. Furthermore, the research progress of full IMC soldered by Cu/Sn, Cu/In, Sn/Ag and Sn/Ni systems was reviewed. It is reported that the main problems restricting the production and application of IMC are too long bonding time and defects such as voids caused by phase transformation. Notably, the structural characteristics and material properties of Cu-Cu joints should be considered comprehensively. In terms of solder system, more binary solder systems based on Sn, Cu and Sn-Cu or ternary solder systems were essential to be developed. Afterwards, the state, size as well as preparation methods of solders should be attached great importance. Besides, in terms of preparation method, the base metal and solder were constructed as a cold and hot microcirculation. On the one hand, the solder was subjected to transient and local high-power heating such as femtosecond laser, local laser or induction heating. On the other hand, the base metal was subjected to high-power refrigeration. Afterwards, appropriate auxiliary vibration and pressure can boost the collision diffusion probability and shorten the diffusion distance, so as to quickly obtain a single full IMC solder joint with high reliability.
Key words: full intermetallic compound; high temperature solder; preparation method; solder systems; cold and hot microcirculation
