(1. 金川集團股份有限公司 鎳鈷資源綜合利用國家重點實驗室，金昌 737100；
2. 蘭州理工大學 省部共建有色金屬先進加工與再利用國家重點實驗室，蘭州 730050；
3. 蘭州理工大學 白銀新材料研究院，白銀 730900)
摘 要: 為了研究可溶性/不可溶性陽極隔膜電解工藝生產的電解鎳與電積鎳在結構和性能之間的差異，利用XRD、SEM等分析手段進行擇優(yōu)取向、晶粒尺寸、微觀組織及斷口形貌等計算和分析。結果表明：電解鎳的品質要明顯優(yōu)于電積鎳的品質，電積鎳和電解鎳表面(200)面都呈現出單一高擇優(yōu)生長，截面(111)面和(200)面也都呈雙擇優(yōu)取向。兩種電沉積鎳的晶粒尺寸都為幾十個納米，電解鎳平均晶粒尺寸為34.3 nm，小于電積鎳的平均晶粒尺寸47.6 nm，說明電解鎳的晶粒更為細小。兩種電沉積鎳的生長機制都是由開始時的螺旋位錯生長變?yōu)槔鄯e長大機制，兩者表面顯微組織都有平行于表面的棱錐狀脊階，部分區(qū)域出現類似于菌落狀或胞狀形態(tài)。兩者截面顯微組織都為層片狀，靠近始積片區(qū)域沉積層晶粒為細小等軸晶，越遠離始極片區(qū)域沉積層晶粒尺寸越大且擇優(yōu)取向越明顯。但電解鎳表面脊階較為集中且數量龐大，而電積鎳脊階分散且數量較少，多以零散菌落狀或胞狀形態(tài)分布。兩種電沉積鎳塑性都較好，都為韌性斷裂。電積鎳的抗拉強度和硬度要高于電解鎳，但塑性較電解鎳差。電積鎳韌窩內分布著較多的球形或不規(guī)則形狀的夾雜物，而電解鎳鮮見夾雜物存在。
關鍵字: 電沉積；晶粒尺寸；擇優(yōu)取向；塑韌性；斷口形貌
（1. State Key Laboratory for Comprehensive Utilization of Nickel and Cobalt Resources, Jinchuan Group Co., Ltd., Jinchang 737100, China;
2. State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, Lanzhou 730050, China;
3. Baiyin Novel Materials Research Institute, Lanzhou University of Technology, Baiyin 730900, China）
Abstract:This paper studies the differences of the structure and properties between the two types of electrodeposited nickel produced by soluble/insoluble anode diaphragm electrolysis process. And XRD, SEM and other analytical methods used to determine and analyze the preferred orientation, grain size, microstructure and fracture morphology, etc. The results show that the quality of electrolytic nickel is significantly better than that of electrowinning nickel. The surface (200) of electrowinning nickel and electrolytic nickel shows a single highly preferred growth, and the cross section (110) and (200) also show double preferred orientation. The grain sizes of the two kinds of electrodeposited nickel were tens of nanometers, and the average grain size of electrolytic nickel is 34.3 nm, which is smaller than the average grain size (47.6 nm) of electrodeposited nickel, and the grain size of electrolytic nickel is finer. The growth mechanisms of the two kinds of electrodeposited nickel are from spiral dislocation growth to cumulative growth at the beginning. The surface microstructures of both sides have ridges parallel to the surface, most of which are pyramidal, and some areas are similar to colony or cellular morphology. In addition, the cross-sectional microstructures of both are “l(fā)amellar” structures, and the grains in the deposition layer near the starting plate are fine equiaxed grains. However, the farther away from the starting plate, the larger the grain size and the more obvious the preferred orientation. The difference between the both sides is that the ridge steps on the surface of electrolytic nickel are more concentrated and the number is large, while the ridge steps of electrodeposition nickel are more scattered and less, mostly in the form of scattered colonies or cells. The two types of electrodeposited nickel have good plasticity, and both are ductile fractures. The tensile strength and hardness of electrowinning nickel are higher than those of electrolytic nickel, but its plasticity is worse than that of electrolytic nickel. There are more spherical or irregular-shaped inclusions distributed in the dimples of electrowinning nickel, while electrolytic nickel is the opposite.
Key words: electrodeposition; grain size; preferred orientation; plasticity and toughness; fracture morphology
