(中南大學(xué) 冶金與環(huán)境學(xué)院，長沙 410083)
摘 要: 采用COMSOL多場耦合計算機仿真軟件對氯鹽體系錫隔膜電沉積進行了仿真模擬，研究錫隔膜電積時電解槽內(nèi)離子濃度、流體密度、流體速度、電流密度等的分布特征及其隨時間的變化規(guī)律。結(jié)果表明：錫隔膜電積時槽內(nèi)離子濃度分布受到入口流速、電流密度、電積時間、槽內(nèi)離子互相作用的影響而發(fā)生變化。增加進液速度及降低HCl濃度有利于提高電解液平均密度及陰極表面Sn2+的最低濃度。電積時極板邊緣發(fā)生離子對流，頂部對流速度高于邊緣處對流速度，且流體密度梯度影響離子對流方式。極板周圍電流密度分布呈非均勻分布，在電極邊緣發(fā)生電流偏轉(zhuǎn)。增加電流密度能降低陰極表面Sn2+最低濃度及流體的平均密度，同時也將增加陰極表面流體的平均流速，并使得陰極產(chǎn)物厚度不均勻。
關(guān)鍵字: 錫；隔膜電積；仿真模擬；多場耦合
（School of Metallurgy and Environment, Central South University, Changsha 410083, China）
Abstract:ACOMSOL multi-field coupled computer simulation software was used to simulate tin membrane electrodeposition in the chloride system, and the distribution characteristics of ion concentration, fluid density, fluid velocity, current density and other physical quantities in the cell were studied, as well as the variation law with time. The results show that the ion concentration distribution is affected by the inlet velocity, current density, reaction time and the interaction between the ions. The way of increasing the inlet velocity and decreasing the HCl concentration can improve the average density of electrolyte and the lowest concentration of Sn2+ on the cathode surface. The velocity of the top convection is higher than that of the edge, and the fluid density gradient affects the ion convection mode. The current density distribution around the plate is non-uniform and current deflection occurs at the edge of the electrode. The increase of current density can reduce the lowest concentration of Sn2+ on the cathode surface and the average density of the fluid. It also increases the average flow rate of the fluid on the cathode surface and makes the thickness of the cathode products uneven.
Key words: tin; membrane electrodeposition; simulation; multi-field coupling
