Abstract:The hot deformation behavior of as-solutionized Mg-8Sn-2Zn-0.5Cu (TZC820) alloy was investigated experimentally and numerically via isothermal compression tests at 250-400 °C and strain rate range of 0.01-3 s^-1 on a Gleeble-1500D thermomechanical simulator. Results show that the deformation temperature and strain rate signi？cantly affected ？ow stress and material constants. In addition, the strain-compensated constitutive relationship was established on the basis of true stress-strain curves. The main deformation mechanism for this alloy was the dynamic recrystallization (DRX), and the DRX degree was effectively enhanced with an increase in deformation temperature and a decrease in strain rate. Moreover, the cellular automaton method was used to simulate the microstructure evolution during hot compression. In addition, the processing maps were established, and the optimum deformation parameters for the as-solutionized TZC820 alloy are at 370-400 °C and 0.01 s^-1, and at 320-360 °C and 1-3 s^-1.

Key words: Mg-8Sn-2Zn-0.5Cu alloy; hot deformation; dynamic recrystallization; processing map