(1. 重慶大學(xué) 材料科學(xué)與工程學(xué)院，重慶 400044；
2. 重慶大學(xué) 機(jī)械傳動(dòng)國家重點(diǎn)實(shí)驗(yàn)室，重慶 400044)
摘 要: 利用熱處理工藝模擬實(shí)際服役工況，通過掃描電鏡(SEM)、EBSD和XRD分析銅/鋁復(fù)合板經(jīng)不同熱處理溫度和時(shí)間后，結(jié)合界面處金屬間化合物(IMCs)的組成、結(jié)構(gòu)和生長規(guī)律，建立生長模型，并測定銅/鋁復(fù)合板的熱擴(kuò)散系數(shù)，研究銅/鋁復(fù)合板界面組織結(jié)構(gòu)特征與導(dǎo)熱性能之間的關(guān)系。結(jié)果表明：IMCs層厚度隨熱處理溫度和時(shí)間的增加而增加；熱處理溫度超過500 ℃時(shí)，界面層出現(xiàn)Al4Cu9、AlCu、Al2Cu3和Al2Cu 4種IMCs；界面IMCs厚度與時(shí)間呈冪函數(shù)關(guān)系，各層生長速率與溫度之間滿足Arrhenius關(guān)系；隨著IMCs厚度的增加，銅/鋁復(fù)合板的熱擴(kuò)散系數(shù)下降，導(dǎo)熱性能下降。同時(shí)，研究結(jié)果為優(yōu)化銅/鋁復(fù)合板制備工藝和建立應(yīng)用準(zhǔn)則提供理論基礎(chǔ)和科學(xué)依據(jù)。
關(guān)鍵字: 銅鋁復(fù)合板；界面擴(kuò)散；金屬間化合物；導(dǎo)熱性
（1. College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China;
2. State Key Laboratory of Mechanical Transmissions, Chongqing University, Chongqing 400044, China）
Abstract:The actual service conditions were simulated by different heat treatment processes. The interfacial intermetallic compounds (IMCs) component, structure and growth law were investigated by scanning electron microscopy (SEM), EBSD and X-Ray diffraction, and the growth model was established. The thermal diffusivity α was measured and the relationship between interfacial structure characteristics and thermal conductivity of Cu/Al composite sheet was studied. The results indicate that the IMCs are Al4Cu9, AlCu, Al2Cu3 and Al2Cu during above 500 ℃ treatment. The interfacial layer width increases with the increase of the hot treatment temperature and time. The interfacial thickness and annealing time follow the power function relation, the growth rates of the intermetallic phase layers and annealing temperature comply with the Arrhenius relation. With the total thickness of the interfacial IMCs increasing during annealing, the thermal diffusivity of Cu/Al composite decreases. The results provide the theoretical and scientific basis for the optimizing of the preparation process of Cu/Al composite sheet and establishing the application criteria.
Key words: Cu/Al clad sheets; interfacial diffusion; intermetallic compounds (IMCs); thermal conductivity
