(1. 蘭州理工大學(xué) 甘肅省有色金屬新材料省部共建國家重點(diǎn)實(shí)驗(yàn)室，蘭州 730050；
2. 蘭州理工大學(xué) 有色金屬合金及加工教育部重點(diǎn)實(shí)驗(yàn)室，蘭州 730050)
摘 要: 利用超聲波輔助釬焊工藝方法對Cu/Sn/Cu結(jié)構(gòu)進(jìn)行釬焊實(shí)驗(yàn)，研究超聲波輔助作用下Cu/Sn固-液界面金屬間化合物(IMCs)的形成與演變過程。結(jié)果表明：無超聲作用時(shí)界面處Cu-Sn金屬間化合物形貌逐漸由平直狀轉(zhuǎn)變?yōu)榘纪沟纳蓉悹睿渲蠧u6Sn5的形成主要受擴(kuò)散控制，而Cu3Sn層的形成則是由反應(yīng)控制。施加超聲波后，通過觀察不同超聲條件下Cu-Sn金屬間化合物形貌的微觀結(jié)構(gòu)演變，提出破碎-溶解模型。通過改變超聲時(shí)間來控制界面Cu-Sn金屬間化合物的厚度，從而改善釬焊接頭性能。
關(guān)鍵字: 超聲波輔助釬焊；金屬間化合物；擴(kuò)散；溶解
（1. State Key Laboratory of Gansu Advanced Non-ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, China;
2. Key Laboratory of Non-ferrous Metal Alloys and Processing, Ministry of Education, Lanzhou University of Technology, Lanzhou 730050, China）
Abstract:The Cu/Sn/Cu structure was brazed by ultrasonic assisted soldering. The formation and evolution of Cu-Sn intermetallic compounds (IMCs) by ultrasonic assisted soldering process were investigated. The results indicate that the morphologies of interfacial Cu-Sn intermetallic compounds (IMCs) are gradually transformed from planar shape to scallop-like shape without ultrasonic, in which the formation mechanism of Cu6Sn5 is mainly controlled by diffusion, and the formation mechanism of Cu3Sn layer is controlled by the reaction. After applying ultrasonic, a crush-dissolution model is proposed by observing the evolution of the microstructure of Cu-Sn intermetallic compounds with different ultrasonic conditions. The thickness of the interfacial Cu-Sn intermetallic compounds is controlled by changing the ultrasonic time, which will improve the performance of the brazed joint.
Key words: ultrasonic-assisted soldering; intermetallic compounds; diffusion; dissolution
