(1. 南京航空航天大學(xué) 材料科學(xué)與技術(shù)學(xué)院，南京 211106；
2. 鄭州機(jī)械研究所新型釬焊材料與技術(shù)國家重點(diǎn)實(shí)驗(yàn)室，鄭州450002)
摘 要: 隨著無鉛釬料性能的提升和人們環(huán)保意識(shí)的提高，無鉛釬料也逐漸被應(yīng)用在特殊環(huán)境中。介紹特殊環(huán)境用無鉛釬料可靠性的研究進(jìn)展及趨勢(shì)，分析特殊環(huán)境中無鉛釬料焊點(diǎn)失效的原因，探討各種特殊環(huán)境中提高無鉛釬料可靠性的方法和機(jī)理，如微合金化、顆粒強(qiáng)化和基板改善，總結(jié)目前無鉛釬料可靠性研究存在的不足，對(duì)無鉛釬料未來的研究方向提出建議。
關(guān)鍵字: 特殊環(huán)境；無鉛釬料；微合金化；顆粒強(qiáng)化；基板改善；可靠性
（1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 211106,China;
2. State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou450002, China）
Abstract:Lead-free solders are applied under special conditions with the improvement of property of the solders and people''''s awareness of environmental protection. The research status and development trend of lead-free solders used under special conditions were reviewed synthetically. First of all, the failure mechanism of solder joints under different special conditions was discussed. Moreover, the ways to enhance the reliability of lead-free solders under several special conditions were reported and analyzed, such as microalloying, particle strength and substrate improvement. In addition, the defects of the current reliability research of lead-free solders were summarized, and the further research was prospected.
Key words: special condition; lead-free solder; microalloying; particle strength; substrate improvement; reliability
