(1. 合肥工業(yè)大學(xué) 材料科學(xué)與工程學(xué)院，合肥 230009； 2. 合肥工業(yè)大學(xué) 分析測試中心，合肥 230009； 3. 中國電子科技集團公司 第43研究所，合肥 230088； 4. 合肥工業(yè)大學(xué) 安徽省功能材料與器件重點實驗室，合肥 230009)
摘 要: 采用球磨加常壓燒結(jié)的粉末冶金工藝制備50%SiCp/6061Al(體積分數(shù))復(fù)合材料，研究了燒結(jié)溫度對該高體積分數(shù)SiCp/Al復(fù)合材料結(jié)構(gòu)與性能的影響。結(jié)果表明：球磨有利于形成成分均勻的50% SiCp6061Al復(fù)合粉體；隨著燒結(jié)溫度的升高，50%SiCp/6061Al復(fù)合材料的致密度及抗彎強度先增后減。710 ℃燒結(jié)的復(fù)合材料性能最佳，致密度達到97%，抗彎強度大于400 MPa。該復(fù)合材料中SiCp呈解理斷裂，而Al合金基體呈韌性撕裂的斷裂特征。750 ℃燒結(jié)的50%SiCp/6061Al復(fù)合材料中，SiCp/Al界面反應(yīng)加劇，生成較多的Al4C3相，導(dǎo)致復(fù)合材料結(jié)構(gòu)劣化，性能降低。
關(guān)鍵字: SiCp/Al復(fù)合材料；粉末冶金；燒結(jié)溫度；顯微組織；力學(xué)性能
（1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China; 2. Analysis and Test Center, Hefei University of Technology, Hefei 230009, China; 3. 43 Institute, China Electronics Technology Group Corporation, Hefei 230088, China; 4. Key Laboratory of Functional Materials and Devices of Anhui Province, Hefei University of Technology, Hefei 230009, China）
Abstract:50%SiCp/6061Al (volume fraction) composites were fabricated using powder metallurgy technique via ball-milling and pressureless sintering. The effect of sintering temperature on microstructures and properties of the SiCp/Al composites with high SiCp volume fraction was especially stressed. The results show that ball milling is beneficial to the uniform composition distribution of the 50%SiCp/6061Al composites powder. With increasing the sintering temperature, the density and bending strength of the 50%SiCp/Al composites increase initially and then decrease. The SiCp/Al composite sintered at 710 ℃ has the optimal properties, i.e. the relative density is 97% and the bending strength is above 400 MPa. The SiC particles and Al alloy matrix in the composite follow the cleavage and plastic tearing fracture modes, respectively. As the sintering temperature increases to 750 ℃, an intensive SiCp/Al interfacial reaction takes place to form more Al4C3 phase, resulting in the structural degradation and property reduction of the SiCp/Al composite.
Key words: SiCp/Al composite; powder metallurgy; sintering temperature; microstructure; mechanical property
