(1. 華北水利水電大學(xué) 機(jī)械學(xué)院，鄭州450045； 2. 哈爾濱工業(yè)大學(xué) 先進(jìn)焊接與連接國家重點(diǎn)實(shí)驗(yàn)室，哈爾濱 150001)
摘 要: 以BAg50CuZn釬料為基體，采用硫酸鹽鍍液體系在其表面電鍍錫，經(jīng)熱擴(kuò)散處理制備了鍍錫銀釬料。借助掃描電鏡、能譜分析儀、X射線衍射分析儀等手段分析銀基釬料錫電鍍層的表界面形貌、化學(xué)元素組成、界面物相，并對其表面和界面化學(xué)元素進(jìn)行線掃描和面掃描分析。結(jié)果表明：錫電鍍層結(jié)晶晶粒呈現(xiàn)明顯的(101)、(112)結(jié)晶取向，晶體生長方式為“向上生長”+“側(cè)向生長”混合模式；基體釬料與錫電鍍層結(jié)合緊密，經(jīng)熱擴(kuò)散處理二者之間發(fā)生了互擴(kuò)散作用，形成擴(kuò)散界面區(qū)。在擴(kuò)散界面區(qū)，鍍層中的Sn元素與釬料中的Cu、Ag元素形成了Cu3Sn相和Ag3Sn相。Sn元素在銀基釬料錫電鍍層中分布均勻、無偏析現(xiàn)象。電鍍錫銀釬料擴(kuò)散界面區(qū)主要存在Ag相、Cu相、CuZn相、Ag3Sn相、Cu3Sn相，其中Ag相、Cu相、CuZn相來自基體釬料。銀基釬料錫電鍍層的結(jié)合界面是化合物型形式。
關(guān)鍵字: 銀基釬料；錫電鍍層；表面-界面；能譜分析
（1. School of Mechanical Engineering, North China University of Water Resources and Electric Power, Zhengzhou 450045, China; 2. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China）
Abstract:The sulfate electrolyte was applied to electroplating tin on the surface of BAg50CuZn brazing filler metals, and silver brazing filler metals with electroplating tin was prepared by the thermal diffusion treatment method. The surface-interface morphologies, chemical element compositions and interfacial phases were investigated by scanning electron microscopy (SEM), energy dispersive spectrometry (EDS) and X-ray diffractometry (XRD), respectively. And the chemical elements of the surface and interface were analyzed by line scan and plane scan. The results show that tin electroplated coating and substrate brazing alloys combine firmly, the crystallization orientation of tin electroplated coating is (101) and (112). Tin crystallization displays upward and lateral mixed growth modes. The diffusion interface zone forms because of the mutual diffusion between tin electroplated coating and substrate brazing alloys. The Sn element of tin coatings and Ag, Cu elements of substrate brazing alloys form Ag3Sn phase and Cu3Sn phase at the diffusion interface zone. The distribution of Sn element in tin electroplated coating and substrate brazing alloys is uniform and non-segregation phenomenon. The microstructure of diffusion interfacial zone is composed of Ag phase, Cu phase, CuZn phase, Ag3Sn phase and Cu3Sn phase, in which the Ag phase, Cu phase and CuZn phase are derived from the substrate brazing alloys. The bonding form of compound type appears at the interface of tin electroplated coating and silver brazing alloys.
Key words: silver brazing alloys; tin electroplated coating; surface-interface; energy spectrum analysis
