Abstract:Precious metal solders occupy an important position in the electronics industry, microelectronic packaging, multi-stage vacuum brazing, high temperature technology, jewelry manufacturing, aerospace industry and other fields, the development and applications of gold/palladium based solders is the focus both home and abroad. The low/medium/high temperature gold-based solders which were commonly used in industrial production, military and civil fields were described particularly, as well as the presentation of the palladium-based brazing filler metals for the electronics industry classification brazing, high temperature resistant and special functions, besides that, the characteristics, properties and applications of each series of solders were summarized, and there is a brief overview for the properties of silver-based brazing filler metals. Problems still exist in poor processing performance, high economic costs, toxic elements pollution，lack of basic database of simulation, low reliability of solder joint etc. Accordingly, the future trend of precious metal solders was prospected and solutions to existing problems were seeked mainly from the preparation process, the micro-alloying, adding strengthening phase, matching solder flux, computer simulation and other aspects, which also provides a basic support for the development, application and promotion of precious metal solders.

Key words: precious metal solder; brazing property; application; brittle intermediate compound