(1. 中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083;
2. 湖南人文科技學(xué)院 機(jī)電工程系，婁底 417000;
3. 北京有色金屬研究總院，北京 100088;
4. 湖南文昌科技有限公司，婁底 417000)
摘 要: 采用基于CALPHAD法的熱力學(xué)模擬對Al-xSi-yCu-zMg半固態(tài)高硅鋁合金進(jìn)行合金成分的優(yōu)化設(shè)計(jì)。實(shí)驗(yàn)以元素Si、Cu、Mg為因變量，對Al-Si-Cu-Mg四元高硅鋁合金進(jìn)行熱力學(xué)模擬，并用DSC測試分析驗(yàn)證模擬結(jié)果，對合金成分進(jìn)行了優(yōu)化。結(jié)果表明:Cu、Mg是合金設(shè)計(jì)的兩個(gè)關(guān)鍵元素，能顯著影響液相體積分?jǐn)?shù)對溫度的敏感度以及溫度間隔，而Si元素對其影響較小。結(jié)合半固態(tài)合金熱力學(xué)設(shè)計(jì)判據(jù)，Al-17Si-4.5Cu-1.5Mg、Al-17Si-5Cu-1Mg和Al-17Si-4Cu-2Mg是較理想的半固態(tài)觸變成形用高硅鋁合金。
關(guān)鍵字: 高硅鋁合金;CALPHAD方法;半固態(tài)觸變成形
（1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. Department of Mechanical and Electrical Engineering,
Hunan University of Humanities Science and Technology, Loudi 417000, China;
3. Beijing General Research Institute for Nonferrous Metals, Beijing 100088, China;
4.Hunan Wenchang Technology Company Limited, Loudi 417000, China）
Abstract:The thermodynamic simulation based on CALPHAD method was applied to optimize the high silicon aluminum alloys Al-xSi-yCu-zMg for semi-solid thixoforming. This simulation was performed with three parameters Si, Cu and Mg, and the results were analyzed and compared with the DSC test, and then, the semi-solid alloys were optimized. The results show that Cu and Mg are two key elements for alloys design and can notably affect liquid volume fraction vs temperature sensitivity and temperature interval, while Si has little effect on these two parameters. Considering the criterion of alloys design, some new optimal alloys for semi-solid processing are available:Al-17Si-4.5Cu-1.5Mg, Al-17Si-5Cu-1Mg and Al-17Si-4Cu-2Mg.
Key words: high-silicon aluminum alloy; CALPHAD method; semi-solid thixoforming
