(中南大學(xué)材料科學(xué)與工程學(xué)院，長(zhǎng)沙 410083)
摘 要: 采用復(fù)合電鍍技術(shù)，在酸性硫酸鹽鍍銅電鍍液中加入粒徑為20 μm的金剛石粉體制備Cu-金剛石復(fù)合鍍層。通過(guò)正交試驗(yàn)優(yōu)化Cu-金剛石復(fù)合電鍍的工藝參數(shù)，采用掃描電鏡(SEM)、能譜儀(EDS)和顯微硬度計(jì)研究CuSO4·5H2O濃度、陰極電流密度、金剛石粉體濃度和鍍液溫度對(duì)鍍層質(zhì)量的影響。采用X射線分析儀(XRD)、掃描電鏡(SEM)和摩擦實(shí)驗(yàn)機(jī)表征優(yōu)化后復(fù)合鍍層的相結(jié)構(gòu)、表面形貌及摩擦性能。結(jié)果表明：優(yōu)化的鍍液組成和工藝參數(shù)為CuSO4·5H2O 190 g/L，H2SO4 60 g/L，陰極電流密度10 A/dm2，金剛石粉體濃度20 g/L，鍍液溫度20 ℃；優(yōu)化后的復(fù)合鍍層晶粒均勻，金剛石粉體質(zhì)量分?jǐn)?shù)為21.50%，具有較好的顯微硬度和摩擦性能。
關(guān)鍵字: 復(fù)合電沉積；硫酸銅；濃度；陰極電流密度；金剛石粉體；Cu-金剛石；復(fù)合鍍層；摩擦性能
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The Cu-diamond composite coating was prepared by composite electroplating when diamond particles with diameter of 20 μm were put into acidic sulfate copper plating solution. The optimized technological conditions of Cu-diamond composite electroplating were obtained by orthogonal test. The effects of CuSO4·5H2O concentration, cathode current density, diamond concentration and temperature on the quality of Cu-diamond composite coatings were investigated by SEM, EDS and microhardness tester. The phase structure, surface morphology and tribological properties were investigated by XRD, SEM and friction-abrasion testing machine. The results show that the optimized technological conditions are CuSO4·5H2O 190 g/L, H2SO4 60 g/L; cathode current density, 10A/dm2; diamond concentration, 20 g/L; temperature, 20 ℃. The Cu-diamond composite coating containing 21.50% diamond particles has homogeneous grains, better microhardness and tribological performance.
Key words: composite electroplating; CuSO4·5H2O; concentration; cathode current density; diamond powder; Cu-diamond; composite coating; tribological performance
