(中南大學(xué)材料科學(xué)與工程學(xué)院，長(zhǎng)沙 410083)
摘 要: 金屬基復(fù)合材料憑借其優(yōu)異的性能以及較成熟的制備工藝，成為電子封裝領(lǐng)域研究的重要方向之一。綜述典型的電子封裝用金屬基復(fù)合材料的研究現(xiàn)狀，闡述金屬基復(fù)合材料的熱物理性能設(shè)計(jì)，列舉鋁基、銅基電子封裝復(fù)合材料熱物理性能的影響因素和改進(jìn)措施，介紹常見的制備方法，最后對(duì)金屬基電子封裝材料的發(fā)展趨勢(shì)進(jìn)行展望。
關(guān)鍵字: 電子封裝；金屬基復(fù)合材料；熱導(dǎo)率；熱膨脹系數(shù)
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The metal matrix composites(MMCs) is one of the important directions on the research of electronic packaging due to their excellent properties and increasingly mature manufacturing methods. The progress in the research on typical MMCs for electronic packaging was reviewed. The thermo-physical properties design, the key factors controlling the thermo-physical properties of Al-matrix and Cu-matrix composites, the improvement measures and the common manufacturing methods were discussed. The prospects for the future development of MMCs for electronic packaging were given at the end.
Key words: electronic packaging; metal matrix composites; thermal conductivity; thermal expansion coefficient
