(1. 哈爾濱理工大學(xué)材料科學(xué)與工程學(xué)院，哈爾濱 150080；
2. 哈爾濱職業(yè)技術(shù)學(xué)院機(jī)械工程學(xué)院，哈爾濱 150081)
摘 要: 通過(guò)納米壓痕的方法，采用塑性應(yīng)變與總應(yīng)變的比值表征塑性，對(duì)SAC305/Cu、SAC0307/Cu和SAC0705BiNi/Cu這3種無(wú)鉛焊點(diǎn)的動(dòng)態(tài)硬度、抗蠕變性能及塑性進(jìn)行了對(duì)比。3種焊點(diǎn)的動(dòng)態(tài)硬度隨深度變化趨勢(shì)相同，隨著壓入深度的增加而降低。SAC0705BiNi/Cu的最終動(dòng)態(tài)硬度最高，壓痕深度最小，SAC305/Cu表現(xiàn)出應(yīng)變硬化現(xiàn)象。3種焊點(diǎn)的抗蠕變能力由大到小依次為SAC0705BiNi/Cu、SAC305/Cu、SAC0307/Cu。SAC0705BiNi/Cu焊點(diǎn)的塑性與SAC305/Cu焊點(diǎn)的相當(dāng)。與SAC305 和SAC0307兩種釬料相比，無(wú)鉛釬料SAC0705BiNi通過(guò)Bi和Ni元素的加入，提高釬料的硬度和抗蠕變性能，并且保持較好的塑性。
關(guān)鍵字: 球柵陣列焊點(diǎn)；抗蠕變；塑性；納米壓痕
（1. School of Material Science and Engineering, Harbin University of Technology, Harbin 150080, China;
2. School of Mechanical Engineering, Harbin Vocational and Technical College, Harbin 150081, China）
Abstract:The nanoindentation was performed on the plasticity of Sn-Ag-Cu(SAC) lead-free ball grid array(BGA) solder joint. The ratio of plastic strain to total strain was used to characterize the solder plasticity. SAC305/Cu, SAC0307 /Cu and SAC0705BiNi/Cu component solder joints were compared in terms of dynamic hardness, creep resistance and plasticity. The dynamic hardness of three kinds of solder decreases with increasing the penetration depth. For SAC0705BiNi/Cu, the ultimate dynamic hardness is the highest, and the indentation depth is the smallest. Then, the strain hardening phenomenon of SAC305/Cu is more obvious than that of the others. Thus, the order of creep resistance from big to small is SAC0705BiNi/Cu, SAC305/Cu and SAC0307/Cu. The plasticities of SAC0705BiNi/Cu and SAC305/Cu solder joints are similar. Compared with the other two types of solder, through adding Bi and Ni elements, the hardness and solder creep resistance of SAC0705BiNi solder are improved, and the good plasticity is still maintained.
Key words: ball grid array solder joint; creep resistance; plasticity; nanoindentation
