(1. 河北工程大學(xué)機(jī)電工程學(xué)院，邯鄲 056038；
2. 北京科技大學(xué)材料科學(xué)與工程學(xué)院，北京100083)
摘 要: 為了提高銅鋁復(fù)合材料的冶金結(jié)合質(zhì)量，根據(jù)銅鋁在共晶溫度548 ℃到鋁熔點(diǎn)溫度660 ℃范圍內(nèi)的液相擴(kuò)散結(jié)合機(jī)理，建立相應(yīng)溫度范圍內(nèi)的銅鋁等溫反應(yīng)擴(kuò)散數(shù)學(xué)模型，并對(duì)模型進(jìn)行求解。計(jì)算結(jié)果表明：由于銅鋁相互擴(kuò)散，首先在界面形成銅固溶體(α)和鋁固溶體(γ)，隨后銅鋁界面發(fā)生液化并形成液相擴(kuò)散層(L)和金屬間化合物層(IMC)；隨著加熱時(shí)間延長(zhǎng)，固液界面IMC/L和γ/L分別向α側(cè)和γ側(cè)遷移，界面遷移距離與加熱時(shí)間呈拋物線關(guān)系，拋物線系數(shù)與溫度有關(guān)，溫度越高，系數(shù)越大。
關(guān)鍵字: 銅/鋁；數(shù)學(xué)模型；動(dòng)力學(xué)；液相擴(kuò)散結(jié)合
（1. School of Mechanical and Electrical Engineering, Hebei University of Engineering, Handan 056038, China;
2. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China）
Abstract:In order to improve the metallurgical bonding in Cu/Al composites, the mathematical model of isothermal reactive diffusion between Cu and Al in the temperature range between eutectic temperature 548 ℃ and aluminum melting point of 660 ℃ was established and solved based on the liquid phase diffusion bonding mechanism. The analytical results show that the copper solid solution (α) and the aluminum solid solution (γ) form firstly owing to the interdiffusion between Cu and Al, then the liquid phase diffusion layer (L) and intermetallic compound (IMC) generate and the bonding boundary liquates. The IMC/L and γ/L solid-liquid interface migrate towards the solid solution phase α and the solid solution phase γ, respectively. Furthermore, there exists the parabolic relationship between the interface migration distance and the annealingtime, the parabolic coefficients depend on the temperature, the higher the temperature, the bigger the coefficients.
Key words: copper/aluminum; mathematical model; kinetics; liquid phase diffusion bonding
