(1. 河南科技大學(xué)材料科學(xué)與工程學(xué)院，洛陽 471023；
2. 河南科技大學(xué)有色金屬共性技術(shù)河南省協(xié)同創(chuàng)新中心，洛陽 471023)
摘 要: 采用放電等離子燒結(jié)(SPS)工藝制備(Cu/50W)-3%TiC和Cu/50W兩種復(fù)合材料，分別對兩種復(fù)合材料的顯微組織、顯微硬度、導(dǎo)電率、密度和致密度進(jìn)行分析和測試。利用Gleeble-1500D熱模擬試驗機，在溫度為550~950 ℃、應(yīng)變速率為0.01~1 s-1和總變形量為0.4的條件下，對比研究兩種復(fù)合材料的高溫塑性變形行為和顯微組織變化。結(jié)果表明：添加少量TiC的(Cu/50W)-3%TiC 致密度達(dá)到98.7%，硬度為113HV0.2，導(dǎo)電率為61.4%IACS；(Cu/50W)-3%TiC和Cu/50W復(fù)合材料的高溫流變應(yīng)力-應(yīng)變曲線具有典型的動態(tài)再結(jié)晶特征，峰值應(yīng)力隨變形溫度的降低或應(yīng)變速率的升高而增加。同時，建立了(Cu/50W)-3%TiC復(fù)合材料的高溫變形本構(gòu)方程。
關(guān)鍵字: Cu-W-TiC復(fù)合材料；熱變形；動態(tài)再結(jié)晶；流變應(yīng)力；放電等離子燒結(jié)
（1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China;
2. Collaborative Innovation center of Non-ferrous Materials, Henan Province,
Henan University of Science and Technology, Luoyang 471023, China）
Abstract:The (Cu/50W)-3%TiC and Cu/50W composites were prepared by spark plasma sintering (SPS) method. The microstructure, microhardness, electrical conductivity, density and relative density of the two composites were analyzed and measured, respectively. The plastic deformation characteristics at elevated temperature and microstructure changes of the composites were investigated by a Gleeble-1500D thermal simulator at 550-950 ℃, strain rate of 0.01-1 s-1 and total strain of 0.4. The results show that the comprehensive properties of the (Cu/50W)-3%TiC composite with 33%TiC addition are as follows: relative density of 98.7%，microhardness of 113HV0.2 and electrical conductivity of 61.4%IACS. The true stress-true strain curves of the composites have typical characteristics of dynamic recrystallization. The peak stress increases with the decrease of deformation temperature and the increase of strain rate. The constitutive equations of the (Cu/50W)-3%TiC and Cu/50W composites were established, respectively.
Key words: Cu-W-TiC composite; hot deformation; dynamic recrystallization; flow stress; spark plasma sintering
