(1. 合肥工業(yè)大學(xué) 材料科學(xué)與工程學(xué)院，合肥 230009；
2. 合肥工業(yè)大學(xué) 安徽省粉末冶金工程技術(shù)研究中心，合肥 230009)
摘 要: 以硝酸銅、石墨為原料，采用新穎的凝膠澆注法制備納米銅粉，并利用硅烷偶聯(lián)劑KH550對(duì)制備的納米銅粉進(jìn)行表面抗氧化處理；然后以納米銅粉為導(dǎo)電填料、以雙酚A型環(huán)氧樹(shù)脂(E51)為載體，加入適量的固化劑和稀釋劑、除泡劑、促進(jìn)劑等制備納米銅粉導(dǎo)電膠。采用X射線衍射(XRD)和透射電鏡(TEM)等對(duì)制備銅粉的物相、粒度和形貌等進(jìn)行表征；對(duì)預(yù)處理前后的納米銅粉進(jìn)行熱重與差熱(TG-DSC)分析；并研究納米銅粉添加量對(duì)所制備導(dǎo)電膠電阻率和連接強(qiáng)度等性能的影響。結(jié)果表明：采用凝膠澆注法可制備高純度、分散性良好、平均粒度約為60 nm的類球形銅粉；經(jīng)硅烷偶聯(lián)劑處理后，納米銅粉的抗氧化性能明顯提高；納米銅粉添加量對(duì)所得導(dǎo)電膠的體積電阻率和連接強(qiáng)度有較大影響，納米銅粉添加量為60%(質(zhì)量分?jǐn)?shù))的導(dǎo)電膠的體積電阻率為1.7×10-3 Ω·cm，連接強(qiáng)度為11.4 MPa。
關(guān)鍵字: 納米銅粉；凝膠澆注法；導(dǎo)電膠；電阻率；連接強(qiáng)度
（1. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China;
2. Research Center for Powder Metallurgy Engineering and Technology of Anhui Province,
Hefei University of Technology, Hefei 230009, China）
Abstract:Nano-sized copper powders were prepared by gel-casting method using copper nitrate and graphite as the main raw materials. Silane coupling agent KH550 was used in the surface antioxidant treatment of copper powders. Using the as-prepared nano-sized copper powders as conductive fillers and the bisphenol A epoxy resins (E51) as matrix, nano-copper filled conductive adhesives were prepared by adding appropriate amount of curing agent, thinner, defrother, promoter and other additive agents. X-ray diffraction (XRD) and transmission electron microscopy (TEM) were used to characterize the phase composition, particle size and morphology of the copper powders. The copper powders before and after anti-oxidation treatment was conducted by TG-DSC analysis. The influence of the nano-sized copper powder content on the resistivity and bonding strength of the adhesives was investigated. The results show that the copper powders prepared by gel-casting method are of high purity, well dispersibility and a mean particle size of about 60 nm. After being treated by silane coupling agent, the oxidation property of the nano-sized copper powders can be obviously improved. The content of nano-sized copper powders has a great effect on the volume resistivity and bonding strength of the conductive adhesives, the optimum sample with volume resistivity of 1.7×10-3 Ω·cm and bonding strength of 11.4 MPa can be prepared when the filling amount of nano-sized copper powders is 60% (mass fraction).
Key words: nano-sized copper powder; gel-casting method; conductive adhesive; resistivity; bonding strength
