(中南大學(xué) 粉末冶金國家重點實驗室，長沙 410083)
摘 要: 以仲鉬酸銨為反應(yīng)物，采用熔鹽法在低密度C/C復(fù)合材料孔隙表面制備Mo2C涂層，改善Cu與C/C坯體的潤濕性，然后通過無壓熔滲Cu制備C/C-Cu復(fù)合材料，研究了Mo2C改性層制備溫度對Mo2C涂層和C/C-Cu復(fù)合材料組織結(jié)構(gòu)及性能的影響。結(jié)果表明：Mo2C涂層在坯體內(nèi)部孔隙表面分布均勻，且與炭基體和Cu均有良好的界面結(jié)合。在950~1150 ℃范圍內(nèi)，隨涂層反應(yīng)溫度的提高，Mo2C層厚度由2.0 μm逐漸增大到6.5 μm，C/C-Cu復(fù)合材料的密度逐漸增大，電阻率逐漸降低；抗彎強度呈現(xiàn)先增大后減小趨勢，在涂層反應(yīng)溫度為1000 ℃時呈現(xiàn)最大值251.83 MPa。復(fù)合材料的摩擦因數(shù)均隨磨損時間延長先增大后減小并趨于穩(wěn)定。隨著Mo2C涂層制備溫度的提高，復(fù)合材料的摩擦因數(shù)逐漸增大，體積磨損率先減小后增加，在Mo2C涂層反應(yīng)溫度為1000 ℃時，復(fù)合材料的磨損率最低。
關(guān)鍵字: Mo2C涂層；C/C-Cu復(fù)合材料；熔滲；摩擦性能
（State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China）
Abstract:In order to improve the wetting ability between molten copper and C/C preform, Mo2C interlayer was fabricated on the internal surface of C/C preform via molten salt deposition using ammonium paramolybdate as reactant. Then, C/C-Cu composites were prepared by pressureless infiltration. The influences of preparation temperature of Mo2C interlayer on the microstructure and properties of Mo2C interlayer and C/C-Cu composite were investigated. The results show that the Mo2C interlayer covered internal pore surface of the C/C preform uniformly has a good interface bonding with C/C substrate and Cu. With the increase of preparation temperature in the range of 950-1150 ℃, the thickness of the Mo2C interlayer increases from 2.0 μm to 6.5 μm, the density of C/C-Cu composite increases, the electrical resistivity decreases, the flexural strength firstly increases and then decreases, and reaches the maximum value (251.83 MPa) at 1000 ℃. The friction coefficient of the C/C-Cu composite firstly increases and then decreases to a stable value with friction time increasing. With the increase of the reaction temperature, the friction coefficient increases, the volume abrasion rate firstly decreases and then increases, and reaches the minimum value at 1000 ℃.
Key words: Mo2C interlayer; C/C-Cu composite; infiltration; tribological property
