(中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083)
摘 要: Diamond/Al復(fù)合材料作為第四代電子封裝材料，具有高熱導(dǎo)率、低熱膨脹系數(shù)和低密度等優(yōu)良性能，成為研究重點(diǎn)。論述diamond/Al復(fù)合材料研究概況，分析擠壓鑄造、浸滲法和放電等離子燒結(jié)制備方法的優(yōu)點(diǎn)和缺點(diǎn)，討論熱導(dǎo)率和熱膨脹系數(shù)等熱物理性能的影響因素，并對其發(fā)展前景進(jìn)行展望。
關(guān)鍵字: 電子封裝；Diamond/Al復(fù)合材料；熱導(dǎo)率；熱膨脹系數(shù)
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:Diamond/aluminum composites, the fourth generation of electronic packaging materials, have attracted much attention for their remarkable comprehensive properties, such as high thermal conductivity, low coefficient of thermal expansion and low density. The research situation in diamond/aluminum composites was surveyed, and the advantages and disadvantages of the preparation processes that include squeeze casting, infiltration and spark plasma sintering were analyzed. Factors related to thermophysical properties, such us thermal conductivity and coefficient of thermal expansion were discussed. Finally, the relevant problems and development tendency were also addressed.
Key words: electronic packaging; diamond/aluminum composites; thermal conductivity; thermal expansion coefficient
