(1. 東北大學(xué) 材料與冶金學(xué)院，沈陽 110819；
2. 裝甲兵工程學(xué)院 再制造技術(shù)國(guó)防科技重點(diǎn)實(shí)驗(yàn)室，北京 100072；
3. 裝甲兵工程學(xué)院 機(jī)械產(chǎn)品再制造國(guó)家工程研究中心，北京 100072)
摘 要: 為提高鍍層沉積速度和沉積質(zhì)量，采用新型的柔性摩擦輔助電沉積技術(shù)在不同的電流密度下制備了鎳鍍層。利用SEM、XRD、X射線應(yīng)力衍射儀以及硬度計(jì)等手段對(duì)鎳鍍層的組織結(jié)構(gòu)和性能進(jìn)行了表征。結(jié)果表明：電流密度對(duì)柔性摩擦輔助電沉積鎳鍍層的質(zhì)量具有重要影響。在1~13 A/dm2的電流密度范圍內(nèi)，隨著電流密度的增大，柔性介質(zhì)的摩擦整平作用逐漸減弱，鍍層的擇優(yōu)取向發(fā)生了(111)晶面向(200)晶面的過渡轉(zhuǎn)變；當(dāng)電流密度達(dá)到13 A/dm2時(shí)，鎳鍍層出現(xiàn)了(200)和(220)晶面的雙擇優(yōu)取向，但擇優(yōu)取向程度不大；電流密度為10 A/dm2時(shí)，柔性摩擦輔助電沉積鎳鍍層具有最低的拉應(yīng)力，為150 MPa左右，最小的表面粗糙度為Ra=0.48 μm，最小的孔隙率為0.08 cm-2，最高的硬度為385 HV。
關(guān)鍵字: 電沉積；電流密度；柔性摩擦；顯微組織；擇優(yōu)取向
（1. School of Materials and Metallurgy, Northeastern University, Shenyang 110819, China;
2. National Key Laboratory for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072, China;
3. National Engineering Research Center of Mechanical Products Remanufacturing,
Academy of Armored Forces Engineering, Beijing 100072, China）
Abstract:In order to improve the speed and quality of deposition, Ni coatings were prepared by a novel flexible medium friction assisted electrodeposition technology at different current densities. The microstructures and properties of the Ni electroplating were characterized by SEM, XRD, X-ray stress diffraction and micro hardness tester, respectively. The results show that the current density has important effect on the quality of electrodeposited Ni coatings by flexible medium friction. At the current density of 1-13 A/dm2, with increasing current density, the leveling power gradually becomes weaken by flexible medium friction, and the preferred orientation of Ni coatings transits from (111) crystal face to (200) crystal face. When the current density reaches 13 A/dm2, the electrodeposited Ni shows dual preferred orientation of (200) and (220) crystal face, but the degree is not too high. At the current density of 10 A/dm2, flexible medium friction assisted Ni electroplating has the lowest residual stress about 150 MPa, lowest surface roughness Ra of 0.48 μm, lowest porosity of 0.08 cm-2 and highest microhardness of 385 HV.
Key words: electrodeposition; current density; flexible friction; microstructure; preferred orientation
