(1. 重慶理工大學 材料科學與工程學院，重慶 400054；
2. 重慶平偉科技(集團)有限公司，重慶 400026)
摘 要: 分別采用低溫攪拌釬焊和潤濕平衡法對Sn-Cu-Ag亞共晶釬料及其納米復合釬料進行釬焊，并對其進行時效處理。結果發(fā)現(xiàn)：納米Ni顆粒有利于金屬間化合物(IMC)的形成，在釬焊界面形成孔洞狀的(CuxNi1-x)6Sn5；采用低溫攪拌釬焊工藝時，時效過程中兩種接頭的IMC厚度與時效時間 的擬合直線完全重合，納米顆粒對IMC結構的改變作用不明顯；采用潤濕反應釬焊工藝，添加顆粒后釬料中元素互擴散系數(shù)降低一個數(shù)量級，納米顆粒對時效過程中IMC的生長有明顯的抑制作用。
關鍵字: 納米顆粒；攪拌釬焊；IMC；潤濕平衡；時效處理
（1. School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;
2. Chongqing Pingwei Technology (Group) Co., Ltd., Chongqing 400026, China）
Abstract:Soldering with Sn-Cu-Ag eutectic solder or its composite solder by low-temperature stirring soldering and wetting balance method were implemented respectively, and the aging treatments were performed. The results show that the nano-Ni particles are beneficial to the formation of IMC, and the hole shape (CuxNi1-x)6Sn5 forms in the soldering interface. With low-temperature soldering process, the fitting line of the IMC thickness and aging time is totally coincident in two soldering joint, and the structural change of the IMC due to adding nano-particles is not obvious. With the wetting balance test method, the mutual diffusion coefficient reduces by an order of magnitude after adding nanoparticles, the nano-Ni particles are beneficial to inhibiting the growth of IMC.
Key words: nanoparticle; stirring soldering; IMC; wetting balance; aging treatment
