(1. 東北大學(xué) 材料與冶金學(xué)院，沈陽 110819；2. 東北大學(xué) 材料電磁過程教育部重點實驗室，沈陽 110819)
摘 要: 研究退火溫度對異步軋制法制備的銅/鋁復(fù)合板界面組織及力學(xué)性能的影響，采用SEM觀察界面組織形貌，結(jié)合EDX、XRD分析界面物相成分，采用顯微硬度和室溫拉伸實驗表征復(fù)合板的力學(xué)性能。結(jié)果表明，異步軋制法制備的銅/鋁復(fù)合板界面形變儲能較高，退火溫度為400 ℃時界面擴散明顯；隨著退火溫度的升高，復(fù)合界面先后生成金屬間化合物CuAl2、Cu9Al4、CuAl相，界面撕裂位置位于金屬間化合物之間；界面層的顯微硬度比基體的高，這是因為受到硬脆性化合物和高溫軟化的共同影響；退火溫度越高，復(fù)合板抗拉強度越低，斷裂伸長率越大。研究表明，異步軋制法制備的銅/鋁復(fù)合板最佳退火溫度為400 ℃。
關(guān)鍵字: 銅/鋁復(fù)合板；金屬間化合物；退火；軋制復(fù)合；界面
（1. School of Materials and Metallurgy, Northeastern University, Shenyang 110819, China;2. Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University,Shenyang 110819, China）
Abstract:The effects of annealing temperature on the interfacial microstructure and mechanical properties of Cu/Al clad sheet fabricated by asymmetrical roll bonding were investigated according to the microstructure observation by scanning electrical microscope (SEM) and the phase constituent measurement by energy dispersive X-ray detector (EDX) as well as X-ray diffractometer (XRD), in addition with the microhardness of interfacial zone and tensile test of clad sheet. The results indicate that the interfacial layer of Cu/Al clad sheet fabricated by asymmetrical roll bonding grows heavily at 400℃ due to the accumulated deform energy. The intermetallic compounds form in the order of CuAl2, Cu9Al4 and CuAl with increasing the annealing temperature, and peeling occurs between them. The interfacial microhardness is higher than that of the matrix due to the effect of annealing recovery and brittle intermetallic compound. The ultimate tensile strength decreases with rising the annealing temperature, while the elongation increases. According to the experiments, the optimal annealing temperature for Cu/Al clad sheet fabricated by asymmetrical roll bonding is 400 ℃.
Key words: Cu/Al clad sheet; intermetallic compound; annealing; roll bonding; interface
