(中南大學 材料科學與工程學院，長沙 410083)
摘 要: 微電子技術(shù)的飛速發(fā)展對電子封裝材料提出更高的要求，傳統(tǒng)電子封裝材料已難以滿足現(xiàn)代封裝需要。新型噴射沉積電子封裝用高硅鋁合金以其組織細小均勻、各向同性、熱膨脹系數(shù)低、熱導率高、密度低，且具有良好的機械加工、涂覆性能以及焊接性能等優(yōu)良的綜合性能成為研究焦點。主要探討高硅鋁合金的噴射沉積制備方法、組織性能和研究動態(tài)，并對其發(fā)展前景進行展望。
關(guān)鍵字: 高硅鋁合金；電子封裝；噴射沉積；熱膨脹系數(shù)；熱導率；密度
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The increasing development of modern microelectronic technology contributes to a higher demand for packaging materials. However, traditional ones can no longer work well for the modern packaging. A new series of spray deposition high Si-Al alloys developed for electronic packaging have attracted much attention for their remarkable comprehensive properties, such as combination of uniform small microstructure, low coefficient of thermal expansion, light mass and good machinability as well as easily coated and welded. The spray deposition process，microstructure, performance as well as research status were discussed, and the relevant problems and development tendency corresponding were also addressed.
Key words: high Si-Al alloys; electronic packaging; spray deposition; coefficient of thermal expansion; thermal conductivity
