(中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083)
摘 要: 闡述電子封裝材料的基本要求，論述高硅鋁合金材料的研究概況及其性能特點，分析熔煉鑄造、浸滲法、快速凝固/粉末冶金和噴射沉積制備方法的優(yōu)缺點，并指出高硅鋁合金電子封裝材料的發(fā)展方向。
關(guān)鍵字: 高硅鋁合金；電子封裝；性能；熔煉鑄造；浸滲法；噴射沉積
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:Basic requirements of electronic packaging materials were reviewed, the characteristics and research situation of the high aluminum-silicon alloys were discussed, and the advantages and disadvantages of the preparation processes that include casting, infiltration, rapid solidification powder metallurgy and spray-forming were analyzed. Moreover, the development tendency of high aluminum-silicon alloy electronic packaging materials was pointed out.
Key words: high silicon aluminum alloy; electronic packaging; casting; infiltration; spray-forming
