(河南科技大學(xué) 材料科學(xué)與工程學(xué)院，洛陽 471003)
摘 要: 利用X射線衍射分析儀(XRD)和JSM-5610LV掃描電鏡(SEM)研究RE含量對(duì)Sn2.5Ag0.7Cu/Cu焊點(diǎn)界面區(qū)顯微組織、剪切強(qiáng)度和蠕變斷裂壽命的影響。結(jié)果表明：Sn2.5Ag0.7CuxRE焊點(diǎn)界面區(qū)金屬間化合物由靠近釬料側(cè)Cu6Sn5和靠近Cu基板側(cè)Cu3Sn構(gòu)成；添加微量RE可細(xì)化Sn2.5Ag0.7Cu焊點(diǎn)內(nèi)釬料合金的顯微組織和改善釬焊接頭界面區(qū)金屬間化合物的幾何尺寸及形態(tài)；當(dāng)RE添加量為0.1%時(shí)，焊點(diǎn)的剪切強(qiáng)度最高，蠕變斷裂壽命最長。
關(guān)鍵字: Sn2.5Ag0.7CuxRE/Cu焊點(diǎn)；顯微組織；剪切強(qiáng)度；蠕變斷裂壽命
（College of Material Science and Engineering, Henan University of Science and Technology,
Luoyang 471003, China）
Abstract:The effects of rare earth (RE) on the microstructure, shear strength and creep rupture life of the Sn2.5Ag0.7Cu/Cu solder joints were investigated by X-ray diffractometry, JSM-5610LV scanning electronic microscopy. The results show that the intermetallic compound (IMC) interfacial layer of soldered joints between Sn2.5Ag0.7CuxRE lead-free solder and copper substrate usually includes two parts of Cu6Sn5 near the solder alloy, and Cu3Sn nearside the Cu substrate. Adding tiny RE in Sn2.5Ag0.7Cu lead-free solder alloy can refine the microstructure of the solder joints and affect the size and configuration of the IMC of interfacial layer. When the RE adding content of Sn2.5Ag0.7Cu solder alloy is 0.1% in mass fraction, the shear strength of the solder joint is the highest and its creep rupture life is the longest.
Key words: Sn2.5Ag0.7CuxRE/Cu solder joints; microstructure; shear strength; creep rupture life
