(中南大學(xué) 粉末冶金國(guó)家重點(diǎn)實(shí)驗(yàn)室，長(zhǎng)沙 410083)
摘 要: 針對(duì)鋁電解用金屬陶瓷惰性陽(yáng)極材料與金屬導(dǎo)桿的電連接困難問(wèn)題，以Al(H2PO4)3為膠粘劑，CuO為固化劑，NiFe2O4陶瓷粉和Cu-Ag合金粉為填充料，連接NiFe2O4基金屬陶瓷。通過(guò)分析Al(H2PO4)3與CuO的反應(yīng)過(guò)程，觀察磷酸鹽連接NiFe2O4基金屬陶瓷的界面形貌，探索其高溫連接機(jī)理。結(jié)果表明：Al (H2PO4)3與CuO反應(yīng)后生成的Cu-P-O化合物是主要連接物相；Cu-P-O化合物隨溫度的變化逐步發(fā)生一系列物相變化，并在960~ 1 000℃下逐步分解為CuO和P2O5；在不同熱處理溫度下，磷酸鹽與NiFe2O4基金屬陶瓷連接界面始終保持緊密結(jié)合狀態(tài)；低溫下連接層與金屬陶瓷潤(rùn)濕性良好并依靠吸附作用相互連接，高溫下連接層與金屬陶瓷依靠互擴(kuò)散作用相互連接。
關(guān)鍵字: 金屬陶瓷；磷酸二氫鋁；鐵酸鎳；界面形貌；連接機(jī)理
phosphate bonding NiFe2O4 cermet
（State Key Laboratory of Power Metallurgy, Central South University, Changsha 410083, China）
Abstract:The electrical bonding of inert anode cermet with metal was hard to solve. A phosphate bonding technology of NiFe2O4 cermet was explored using Al(H2PO4)3 as adhesive, CuO as curing agent, NiFe2O4 ceramic powder and Cu-Ag alloy powder as filler. The reaction process of Al(H2PO4)3 and CuO was analyzed. The microstructures of bonding interface were investigated. The bonding mechanism was studied. The results show that the main bonding phase are Cu-P-O compounds, the reaction product of Al(H2PO4)3 and CuO at different temperatures. The Cu-P-O compounds reveal different crystal structures at different temperatures, and decompose into CuO and P2O5 at temperature range of 960−1 000 ℃. The phosphate and NiFe2O4 cermet bonding interface remains closely connected state at different heat-treated temperatures. At low temperature, the wetting property is good between cermet and phosphate bonding phase. And the cermet and bonding layer rely on the adsorption capacity to connect each other. At high temperature, the cermet and bonding layer rely on the diffusion to connect each other.
Key words: cermet; Al (H2PO4)3; NiFe2O4; interface microstructure; bonding mechanism
