(中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083)
摘 要: 總結(jié)微電子封裝技術(shù)對封裝基片材料性能的要求，論述Al2O3、AlN、BeO、SiC和Si3N4陶瓷基片材料的特點(diǎn)及其研究現(xiàn)狀，其中AlN陶瓷基片的綜合性能最好。分析軋膜、流延和凝膠注模薄片陶瓷成型工藝的優(yōu)缺點(diǎn)，其中水基凝膠注模成型工藝適用性較強(qiáng)；指出陶瓷基片材料和薄片陶瓷成型工藝的發(fā)展趨勢。
關(guān)鍵字: 電子封裝材料；Al2O3陶瓷；AlN陶瓷；BeO陶瓷；SiC陶瓷；Si3N4陶瓷；流延成型；凝膠注模成型
electronic packaging
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract:The elemental requirements for electronic packaging substrate materials are summarized. The characteristics of alumina, aluminum nitride, beryllium, silicon carbide, silicon nitride ceramics substrates used for electronic packaging and the recent research achievements of the electronic packaging ceramic substrate materials are discussed, the aluminum nitride has the best comprehensive properties among them. The advantages and disadvantages of tape calendaring, tape casting, gel-casting technologies for forming thin ceramics are analyzed, gel-casting in which has relatively strong applicability. The development trends of ceramic substrate materials and forming technologies are pointed out.
Key words: electronic packaging materials; alumina ceramics; AlN ceramics; beryllium ceramics; silicon carbide ceramics; silicon nitride ceramics; tape casting; gel-casting
