(1. 江蘇大學(xué) 材料科學(xué)與工程學(xué)院，鎮(zhèn)江 212013；
2. 江蘇科技大學(xué) 材料科學(xué)與工程學(xué)院，鎮(zhèn)江 212003)
摘 要: 采用擴(kuò)散釬焊方法對6063鋁合金/鍍銀層/1Cr18Ni9Ti不銹鋼進(jìn)行焊接，探討焊接界面金屬間化合物的生長行為。結(jié)果表明：釬縫中靠近不銹鋼一側(cè)為Fe-Al金屬間化合物層，靠近鋁合金一側(cè)主要是Ag(Al)固溶體，中心區(qū)域由Ag-Al化合物和Ag(Al)固溶體混合而成；隨著低溫?cái)U(kuò)散保溫時間的延長，化合物層厚度隨之增加，Ag在鋁合金一側(cè)富集出現(xiàn)晶界滲透現(xiàn)象；釬縫中首先產(chǎn)生Ag-Al金屬間化合物，之后共晶液相中的Al原子穿越Ag-Al金屬間化合物層和殘余鍍銀層擴(kuò)散至不銹鋼一側(cè)，與Fe原子生成Fe-Al金屬間化合物；在任意給定的擴(kuò)散釬焊低條件下，可以對化合物層厚度進(jìn)行初步估算。
關(guān)鍵字: 鋁合金；6063鋁合金；不銹鋼；Ag；擴(kuò)散釬焊；化合物生長
growth behavior of interface compound
（1. School of Material Science and Engineering, Jiangsu University, Zhenjiang 212013, China;
2. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China）
Abstract:The 6063 Al alloy/Ag plating layer/1Cr18Ni9Ti was joined by diffusion brazing. The growth behavior of the intermetallics (IMC) at the interface was discussed. The results show that Fe-Al IMC layer and Ag (Al) solid solution form in the side of stainless steel and Al alloy in the joint, respectively. Meanwhile, the microstructure at the centre zone is composed of Ag-Al IMC and Ag (Al) solid solution. As the diffusion holding time at low temperature is prolonged, the thickness of IMC layer increases. The grain boundary penetration is obvious due to the side of Al alloy rich in Ag. Ag-Al IMC forms initially, and then Fe-Al IMC occurs as Al atom diffusing through Ag-Al IMC layer and residual Ag plating layer and reacting with Fe atom in the stainless steel. The thickness of IMC layer can be estimated in the optional given condition of diffusion brazing.
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