(1. 大連理工大學(xué) 材料科學(xué)與工程學(xué)院，大連 116024；
2. 大連理工大學(xué) 遼寧省先進(jìn)連接技術(shù)重點(diǎn)實(shí)驗(yàn)室，大連 116024)
摘 要: 研究磷含量為6.5%(質(zhì)量分?jǐn)?shù))的化學(xué)鍍Ni-P薄膜與Sn-3.5Ag釬料合金之間的潤濕行為，以及Sn-3.5Ag/Ni-P焊點(diǎn)在釬焊和時(shí)效過程中的界面反應(yīng)。結(jié)果表明：250 ℃時(shí)，直徑為(2.3±0.06) mm的Sn-3.5Ag焊球在化學(xué)鍍Ni-6.5%P薄膜上釬焊后得到的潤濕角約為44˚，鋪展率約為67%；焊點(diǎn)界面由Ni3Sn4 IMC層、及較薄的Ni-Sn-P過渡層構(gòu)成Ni3P晶化層；釬焊過程中界面Ni3Sn4 IMC的生長速率與釬焊時(shí)間t1/3呈線性關(guān)系；時(shí)效過程中界面Ni3Sn4 IMC及富P層的生長速率與時(shí)效時(shí)間t1/2呈線性關(guān)系。
關(guān)鍵字: 化學(xué)鍍Ni-P薄膜；Sn-3.5Ag釬料；界面反應(yīng)；釬焊；時(shí)效
中圖分類號(hào)：TQ153.2 文獻(xiàn)標(biāo)志碼：A
electroless Ni-P during soldering and aging
（1. School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China;
2. Key Laboratory of Liaoning Advanced Welding and Joining Technology,
Dalian University of Technology, Dalian 116024, China）
Abstract:The wetting behavior of Sn-3.5Ag solder on the electroless Ni-P film with 6.5% P (mass fraction) during soldering and the interfacial reactions between Sn-3.5Ag solder and electroless Ni-6.5% P during soldering and aging were investigated. The results show that the wetting angle is about 44˚ and the spreading coefficient is about 67% using the solder balls with diameter of (2.3±0.06) mm at 25 ℃. The soldering interface are composed of a Ni3Sn4 IMC layer, a thinner Ni-Sn-P layer and a Ni3P crystallization layer between Sn-3.5Ag solder and electroless Ni-P. The growth kinetics of the interfacial IMC Ni3Sn4 during soldering follows a linear relation with cubic root of soldering time. The growth kinetics of interfacial IMC Ni3Sn4 and P-enriched layer during aging obeys a linear relation with square root of aging time.
Key words: electroless Ni-P film; Sn-3.5Ag solder; interfacial reaction; soldering; aging
