(1.北京科技大學(xué)化學(xué)系，北京100083；
2.北京航空航天大學(xué)材料科學(xué)系，北京100083)
摘 要: 采用計算機采樣等實驗手段，研究了外電場在誘發(fā)非催化活性金屬銅表面產(chǎn)生化學(xué)鍍鎳過程中的作用。研究結(jié)果表明，當(dāng)銅基體電位等于或低于臨界誘發(fā)電位時才有可能引發(fā)化學(xué)鍍自催化沉積。試樣的表面狀況、溶液條件和通電電流密度都對臨界誘發(fā)時間有影響。銅基體達到臨界誘發(fā)電位-0.520V (vs SCE)和臨界誘發(fā)時間是引發(fā)化學(xué)鍍鎳成功的必要和充分條件。計算表明，新生的鎳原子如果以單原子層覆蓋銅表面，其覆蓋率大約為12%就足以誘發(fā)化學(xué)鍍鎳自催化過程。
關(guān)鍵字: 電場誘發(fā) 化學(xué)鍍鎳 誘發(fā)過程
PROCESS OF ELECTROLESS NICKEL PLATING
（1.University of Science and Technology Beijing, Beijing100083
2.University of Aeronautics and Astronautics Beijing, Beijing100083）
Abstract:The induction of electroless Ni-P deposition on copper substrate by virtue of the external direct electric field was investigated. The data acquisition was carried out by microcomputer. The experimental results indicate that: (1) The potential of copper substrate has to be equal to or more negative than the critical induction potential -0.520 V (vs SCE), otherwise the deposition of electroless nickel would not occur; (2) The critical induction time depends on the
surface state of the sample, the solution and the current density; (3) Surface coverage of 12% is enough for the substantial initiation of the electroless deposition, if the newborn nickel atoms are deposited in the form of monolayer.
Key words: electric field electroless nickel plating induction process
