潤(rùn)濕動(dòng)力學(xué)
(1. 華南理工大學(xué) 材料科學(xué)與工程學(xué)院，廣州 510640；
2. Center for Manufacturing, The University of Kentucky, Lexington 40506, USA)
摘 要: 對(duì)錫−鉛共晶釬料63Sn-37Pb在Cu基板及Cu-Sn金屬間化合物表面層基板上的反應(yīng)潤(rùn)濕動(dòng)力學(xué)特性進(jìn)行研究。結(jié)果表明：63Sn-37Pb釬料在Cu基板上的鋪展特性隨界面反應(yīng)過(guò)程中液態(tài)釬料中Sn組元的消耗而變化；釬料熔化后的初始鋪展符合簡(jiǎn)單流體規(guī)律，隨后在Sn組元充足的條件下釬料以穩(wěn)定速率鋪展；隨著Sn組元的不斷消耗，潤(rùn)濕機(jī)制呈現(xiàn)界面活性元素?cái)U(kuò)散控制的反應(yīng)鋪展特征；63Sn-37Pb在Cu-Sn IMC表面層基板上呈現(xiàn)出非常好的鋪展能力，遠(yuǎn)優(yōu)于其在Cu基板上的鋪展。
關(guān)鍵字: 63Sn-37Pb釬料；界面反應(yīng)；反應(yīng)潤(rùn)濕；擴(kuò)散；固−液界面能
（1. School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China;
2. Center for Manufacturing, The University of Kentucky, Lextington 40506, USA）
Abstract:The wetting kinetics of the eutectic 63Sn-37Pb solder on Cu and Cu-Sn intermetallic compound (IMC) substrates were investigated. The results show that the spreading feature of 63Sn-37Pb solder on the Cu substrate changes with the exhaustion of element Sn as the Cu-Sn interfacial reaction goes on. In the initial stage, the spreading fits the simple liquid flow rule well, while with decreasing Sn, it comes into the typical reactive spreading character stage. The first sub-stage follows a model involving a local chemical reaction controlled wetting with the stable triple line moving rate under the condition of sufficient Sn supply. The second sub-stage shows a wetting behavior that follows a model of diffusion-controlled reactive spreading with the lacking supply of Sn. The spread of eutectic 63Sn-37Pb solder on Cu-Sn intermetallic compound substrates is very well, much better than its spread on Cu substrate.
Key words: 63Sn-37Pb solder; interfacial reaction; reactive wetting; diffusion; solid-liquid interfacial energy
