(1.哈爾濱工業(yè)大學(xué)材料科學(xué)與工程學(xué)院，哈爾濱 100051；
2.北京有色金屬研究總院， 北京 100088)
摘 要: 粉末冶金制備的SiCp/Al復(fù)合材料中，基體與增強(qiáng)體之間存在多種界面類型。 除了少數(shù)的干凈界面、 臺階界面外，具有納米厚度的界面微區(qū)在材料中占大多數(shù)。 進(jìn)一步研究發(fā)現(xiàn)： 界面微區(qū)是鋁多晶體， 而且微區(qū)中存在鎂元素富集, 并分布著點(diǎn)狀的MgAl2O4氧化物。
關(guān)鍵字: 粉末冶金 SiCp/Al 界面結(jié)構(gòu)
（1.Harbin Institute of Technology, Harbin 150001, P. R. China;
2.General Research Institute for Non-ferrous Metals, Beijing 100088, P. R. China ）
Abstract:There are several typies of interface in SiCp/Al composites fabricated by powder metallurgy. Besides a few of the planar and clean interfaces, there are a large number of micro-interface-zones between the reinforcements and the matrix, which comprised of the aluminium crystals with different orientation from the Al matrix near the interface zone, Mg segregation and MgAl2O4 spinel particles.
Key words: powder metallurgy SiCp/Al nterfacial structure
