(上海大學(xué)材料科學(xué)及工程學(xué)院, 上海 200072)
摘 要: 微細(xì)銅粉是可替代貴金屬生產(chǎn)電子漿料的重要原材料。在常壓銨鹽歧化工藝生產(chǎn)微細(xì)銅粉過程中，制取一價銅氨絡(luò)離子溶液是關(guān)鍵步驟，而一價銅氨絡(luò)離子在空氣中極易被氧化。借助Cu(Ⅱ)/Cu(Ⅰ)電對氧化還原電位的測定來獲知不同時刻一價銅氨絡(luò)離子的濃度，研究了一價銅氨絡(luò)離子的氧化速度及其影響因素。實驗表明：溶液溫度越低、氣相中氧分壓愈小、NH3·H2O濃度越大以及NH+4的加入均有利于阻緩一價銅氨絡(luò)離子的氧化。
關(guān)鍵字: 銅氨水系；銅氨絡(luò)離子；Cu(Ⅰ)氧化
（Department of Material Science and Engineering, Shanghai University, Shanghai 200072, P.R.China）
Abstract:Fine copper powder has potentiality to be used instead of precious metals powder for preparation of conductive ink. In production of fine copper powder by disproportionation of ammoniacal cuprous salt under normal pressure, the preparation of cuprous complex solution is the key to the whole process owing to its high oxidability in the air. The oxidation rate of Cu(Ⅰ) and factors influencing on it were investigated by electrochemical method, i.e. measuring the redox potentials of Cu(Ⅱ)/Cu(Ⅰ) couple as a function of [Cu(Ⅰ)] at different moments and conditions. Experimental results showed that decreasing the p(O2) or the reaction temperature and increasing the concentration of NH3·H2O or NH+4 are all helpful to inhibit the oxidation process.
Key words: copper-ammonia-water system; ammoniacal copper complexion; oxidation of Cu(Ⅰ)
