(1. 清華大學(xué)材料科學(xué)與工程系，北京 100084； 2. 洛陽(yáng)銅加工廠，洛陽(yáng) 471039)
摘 要: 研究了合金元素對(duì)Cu-Ni-Si系列引線框架用銅合金性能的影響。發(fā)現(xiàn)合金中時(shí)效析出物具有與δNi2Si相似的晶體結(jié)構(gòu)，Ni及Si元素含量對(duì)材料硬度和電導(dǎo)率有很大影響。當(dāng)Ni及Si元素含量增大時(shí)，由于析出物數(shù)量增多，材料硬度增加；當(dāng)Ni與Si 原子數(shù)之比小于2時(shí)，材料電導(dǎo)率明顯下降，這是由于過(guò)剩Si元素以固溶原子形式存在，強(qiáng)烈損害材料電導(dǎo)率的結(jié)果。加入Zn元素后，保溫過(guò)程中Zn元素在合金與Sn-Pb共晶焊料界面處偏聚，阻礙脆性金屬間化合物層的形成，在425K保溫1000 h后，銅合金與焊料間結(jié)合良好。
關(guān)鍵字: 引線框架；銅合金；硬度；電導(dǎo)率；釬焊
（1. Department of Materials Science and Engineering, Tsinghua University, Beijing 100084, P.R.China
2. Luoyang Copper Working Plant, Luoyang 471039, P.R.China）
Abstract:The effects of alloying elements on the properties of Cu-Ni-Si alloys for lead frame were investigated. It was found that the crystal structure of the precipitates in Cu-Ni-Si alloy is similar to δ-Ni2Si . The hardness and electrical conductivity of materials can be affected remarkably by the contents of Ni and Si elements. The hardness of alloys will increase along with the increasing of Ni, Si contents. The electrical conductivity will decrease significantly if the proportion of Ni and Si contents (in atom) is less than 2∶1 because the surplus Si element will exist as solute atoms in Cu matrix. Because of the addition of Zn element, the joint between copper alloy and Sn-Pb solder was improved remarkably as the formation of the intermetallic compound layer at the interface was impeded by a segregation layer of Zn element during heat treatment.
Key words: lead frame; copper alloys; hardness; electrical conductivity; solder
