——應(yīng)力—應(yīng)變場(chǎng)分布特征及其動(dòng)態(tài)特性
(1. 哈爾濱工業(yè)大學(xué) 現(xiàn)代焊接生產(chǎn)技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室， 哈爾濱 150001；
2.廣島大學(xué) 工學(xué)部彈塑性工學(xué)研究室， 日本， 739)
摘 要: 針對(duì)表面組裝焊點(diǎn)的實(shí)際服役條件， 對(duì)溫度循環(huán)載荷下其內(nèi)部應(yīng)力—應(yīng)變場(chǎng)的分布特征進(jìn)行了有限元數(shù)值模擬。結(jié)果表明，溫度循環(huán)在焊點(diǎn)內(nèi)部導(dǎo)致應(yīng)力循環(huán)，應(yīng)力循環(huán)導(dǎo)致熱棘輪效應(yīng)，即非彈性應(yīng)變累積；在溫度歷史過程中， 應(yīng)力—應(yīng)變場(chǎng)等值分布圖呈現(xiàn)動(dòng)態(tài)特性， 且與溫度歷史相關(guān)。
關(guān)鍵字: 溫度循環(huán)載荷； 表面組裝焊點(diǎn)； 應(yīng)力—應(yīng)變場(chǎng)；動(dòng)態(tài)特性； 有限元數(shù)值模擬
characteristics in SMT solder joints (Ⅰ)
——Dynamic feature of stressstrain field distribution
（1. National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, P.R.China；
2. Department of Mechanical Engineering, Hiroshima University, HigashiHiroshima, 739, Japan）
Abstract:Based on the real service conditions of surface mount solder joints, the finite element numerical simulation was made in order to get the feature of stressstrain distribution in the solder joints under temperature cycling. Analysis results show that temperature cycling leads to stress cycling and the later leads to thermal ratchetting effect and the accumulation of inelastic strain. Furthermore, stressstrain distribution in the solder joints has dynamic feature during temperature cycling and is related to temperature history.
Key words: temperature cycling load； surface mount solder joints； stressstrain field； dynamic feature； finite element numerical simulation
