Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中國有色金屬學報

ZHONGGUO YOUSEJINSHU XUEBAO

第19卷    第9期    總第126期    2009年9月

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文章編號:1004-0609(2009)09-1695-05
含氯低pH值溶液中BDT自組裝膜對銅電極的緩蝕行為
黃文章1,童耀斌2,羅紅群2,李念兵2,李  丹1

(1. 重慶科技學院 化學化工學院,重慶 401331;
2. 西南大學 化學化工學院,重慶 400715
)

摘 要: 采用分子自組裝技術(shù),在銅電極表面形成一層1, 3−二巰基硫醇(BDT)單分子自組裝膜。通過交流阻抗、極化曲線和循環(huán)伏安等電化學方法探討該自組裝膜在3%NaCl溶液中對銅電極的緩蝕作用。實驗表明:BDT能夠有效地組裝到銅的表面形成單分子自組裝膜,BDT自組裝膜能有效地抑制銅基底在3%NaCl腐蝕介質(zhì)以及酸性NaCl溶液中的腐蝕行為;緩蝕效率隨組裝時間的延長逐漸升高并趨于穩(wěn)定,在pH值較低的溶液中仍具有較好的緩蝕效果;當BDT濃度為1.0×10−2 mol/L、組裝時間為40 h時,銅電極的腐蝕電流最小,緩蝕效率最好。

 

關(guān)鍵字: 1, 3-二巰基硫醇;自組裝膜;銅電極;緩蝕

Corrosion inhibition behavior of copper electrode by self-assembled monolayer of BDT in solution with chlorine and low pH value
HUANG Wen-zhang1, TONG Yao-bin2, LUO Hong-qun2, LI Nian-bing2, LI Dan1

1. School of Chemistry and Chemical Engineering, Chongqing University of Science and Technology,
Chongqing 401331, China;
2. School of Chemistry and Chemical Engineering, Southwest University, Chongqing 400715, China

Abstract:Adopting molecular self-assembly technique, a self-assembled membrane of 1, 3-benzenedithiol (BDT) was formed on the surface of the copper electrode. The effect of this membrane on the corrosion inhibition of copper electrode in 3% NaCl solution was investigated by using electrochemical impedance spectroscopy (EIS), polarization curve and cyclic voltammetry (CV). The results show that BDT can be assembled on the surface of copper electrode to form monomolecular self-assembled membrane,and the membrane can efficiently inhibit the copper base corrosion in the 3% NaCl corrosion medium and acidic solution. The inhibition efficiency increases with increasing assembling time and obtains steady state gradually. In the solution with lower pH value, BDT can also keep good inhibitor. When the copper electrode is modified with 1.0×10−2 mol/L BDT for 40 h, the corrosion current is the smallest, the inhibition efficiency is the highest.

 

Key words: 1, 3-benzenedithiol; self-assembled monolayer; copper electrode; corrosion

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

主管:中國科學技術(shù)協(xié)會 主辦:中國有色金屬學會 承辦:中南大學
湘ICP備09001153號 版權(quán)所有:《中國有色金屬學報》編輯部
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