(北京航空航天大學(xué) 機(jī)械工程學(xué)院， 北京 100083)
摘 要: 通過對(duì)SiC顆粒增強(qiáng)Al基復(fù)合材料與Al合金的TLP擴(kuò)散連接試驗(yàn)， 對(duì)異種材料TLP擴(kuò)散連接過程存在的非對(duì)稱性進(jìn)行了深入的研究，并對(duì)異種材料TLP擴(kuò)散連接過程的等溫凝固動(dòng)力學(xué)進(jìn)行了數(shù)學(xué)建模， 且結(jié)合接頭區(qū)域的成分分布進(jìn)行了驗(yàn)證。 研究表明： SiC顆粒增強(qiáng)鋁基復(fù)合材料與鋁合金連接接頭區(qū)域連接界面向鋁合金一側(cè)偏移， 接頭區(qū)域溶質(zhì)原子成分分布非常不均勻； 由于溶質(zhì)原子擴(kuò)散速度以及中間層和母材冶金反應(yīng)的不同，導(dǎo)致異種材料TLP擴(kuò)散連接過程存在明顯的非對(duì)稱性。 所建的等溫凝固動(dòng)力學(xué)模型能夠用來解釋異種材料TLP擴(kuò)散連接過程， 對(duì)于異種材料連接具有重要的理論意義。
關(guān)鍵字: 異種材料； TLP擴(kuò)散連接； 非對(duì)稱性
（School of Mechanical Engineering，
Beijing University of Aeronautics and Astronautics，Beijing 100083，China）
Abstract:Based on the experimental study on TLP diffusion bonding of SiC particle reinforced Al based composite and aluminium alloy， the extensive study on the dissymmetry of dissimilar materials TLP diffusion bonding process was conducted， and the isothermal solidification kinetics of TLP diffusion bonding process of dissimilar materials was mathematical modeled. The numerical results were compared with the content profiles of each element in the joint area. The research indicates that the bonding interface departures to aluminium alloy from the original central line in the joint area of SiC particle reinforced Al-based composite and aluminium alloy， and the content profile of solute atoms distributes fairly asymmetrically. Because of difference of the solute atoms diffusion speeds and the metallurgical reaction between interlayer and base metal， the dissymmetry exists obviously in dissimilar materials TLP diffusion bonding process. And the isothermal solidification kinetics model can be used for illustrating TLP diffusion bonding process of dissimilar materials.
Key words: dissimilar materials； TLP diffusion bonding； dissymmetry
