(大連理工大學(xué) 材料工程系， 大連 116024)
摘 要: 利用差示掃描量熱計(jì)(DSC)測(cè)定了Sn-6Bi-2Ag，Sn-6Bi-2Ag-0.5Cu，Sn-6Bi-2Ag-2.5Sb三種新無(wú)鉛釬料合金的熔化溫度。結(jié)果表明，少量Cu的加入能降低Sn-Bi-Ag系無(wú)鉛釬料合金的熔化溫度，而Sb的加入使合金的熔化溫度升高。利用光學(xué)顯微鏡(OM)、掃描電子顯微 鏡(SEM)、能譜分析(EDX)對(duì)合金的微觀組織進(jìn)行了分析與比較，釬料合金的微觀組織與冷卻條件和合金元素的含量有關(guān)，Sb的加入使析出相的尺寸細(xì)化。硬度測(cè)定表明Sn-Bi-Ag(Cu，Sb)無(wú)鉛釬料合金的硬度遠(yuǎn)大于純Sn的硬度，加入少量的Cu(0.5%)，Sb(2.5%)對(duì)Sn-Bi-Ag系釬料合金的硬度影響較小。
關(guān)鍵字: 無(wú)鉛釬料；Sn-Bi-Ag；微觀組織；熔點(diǎn)
(Cu，Sb) lead-free solder alloys
（Department of Materials Engineering，Dalian University of
Technology，Dalian 116024，China）
Abstract:The melting ranges of the three new lead-free solder alloys Sn-6Bi-2Ag，Sn-6Bi-2Ag-0.5Cu，Sn-6Bi-2Ag-2.5Sb were measured by a differential scanning calorimeter (DSC). The addition of Cu decreases the melting range of solder alloy ，while that of Sb increases the melting range. Their microstructures were rev ea led by using optical microscope (OM)，scanning electron microscope (SEM) and energy dispersive X-ray analysis (EDX). The microstructures of solder alloys strongly depend on the cooling condition and the alloying addition，Sb dissolves in Sn and decreases the precipitation phase sizes of Bi and Ag3Sn. It is shown that the additions of Cu and Sb have a weak effect on the microhardness of the solder alloys.
Key words: lead-free solder; Sn-Bi-Ag; microstructure; melting point
