(山東大學(xué) 材料科學(xué)與工程學(xué)院, 濟(jì)南 250061)
摘 要: 采用真空擴(kuò)散焊工藝方法，對(duì)Cu與Al擴(kuò)散焊接頭的組織性能進(jìn)行了試驗(yàn)研究，利用掃描電鏡(SEM)、電子探針(EPMA)、顯微硬度等測(cè)試方法對(duì)焊接過渡區(qū)及基體組織和性能進(jìn)行了分析。試驗(yàn)結(jié)果表明： 采用真空擴(kuò)散焊工藝，在加熱溫度520～540 ℃，保溫時(shí)間60 min，壓力11.5 MPa時(shí)，在Cu/Al界面處形成明顯的擴(kuò)散過渡區(qū)，擴(kuò)散區(qū)域?qū)捈s40 μm。在銅側(cè)過渡區(qū)中產(chǎn)生金屬間化合物，會(huì)出現(xiàn)顯微硬度高峰區(qū)， 控制Al的擴(kuò)散濃度可避免或減少界面處金屬間化合物的產(chǎn)生。
關(guān)鍵字: 銅； 鋁； 真空擴(kuò)散焊； 顯微組織
joint of copper and aluminum
（School of Materials Science and Engineering,
Shandong University,Jinan 250061, P.R.China）
Abstract:By using vacuum diffusion welding process, the microstructures and performance of diffusion transition zone for the Cu/Al diffusion welding joint were researched by means of SEM, EPMA and micro-hardness test. The results indicate that under the condition of 520～540 ℃ in holding time 60 min and pressure 11.5 MPa, the diffusion joined interface is obviously produced between copper and aluminum. The width of the diffusion interface zone is about 40 μm. The microhardness peak zone is formed in the copper side of the joined interface because of metal compounds such as γ and β phase. By controlling the Al diffusion amount, the brittle intermetallic compounds can be avoided or decreased.
Key words: copper; aluminum; vacuum diffusion welding; microstructure
