(武漢理工大學(xué) 材料復(fù)合新技術(shù)國(guó)家重點(diǎn)實(shí)驗(yàn)室，武漢 430070)
摘 要: 闡述了微波焊接過程中微波和物質(zhì)作用的機(jī)理、陶瓷的升溫特征、實(shí)驗(yàn)裝置的優(yōu)化以及近年來國(guó)內(nèi)外微波焊接陶瓷的發(fā)展?fàn)顩r，分析了焊接過程中存在的問題，并對(duì)微波焊接作出了展望。
關(guān)鍵字: 微波焊接； 陶瓷； 介電損耗
（State Key Laboratory of Advanced Technology for Materials Synthesis
and Processing,Wuhan University and Technology, Wuhan 430070, P.R.China）
Abstract:The interaction mechanism of microwave with ceramics, the characteristics of temperature change and the equipment of microwave joining were expatiated, and the development on microwave joining in recent years was provided, then some problems in the microwave joining process were refered. At last a prospect on microwave joining technology was made.
Key words: microwave joining; ceramics; dielectric loss factor
