(1. 河南科技大學(xué) 材料科學(xué)與工程學(xué)院，洛陽(yáng) 471003；
2. 河南科技大學(xué) 河南省有色金屬材料科學(xué)與加工技術(shù)重點(diǎn)實(shí)驗(yàn)室，洛陽(yáng) 471003)
摘 要: 通過(guò)在Bi5Sb中添加不同含量的Cu形成新型BiSbCu三元合金。結(jié)果表明：在Bi5Sb釬料合金中添加0.5%~5.0%(質(zhì)量分?jǐn)?shù))Cu，BiSbCu釬料合金的熔點(diǎn)變化不大，但其潤(rùn)濕性能和力學(xué)性能明顯改善；當(dāng)Cu含量為1.5%時(shí)，(Bi5Sb)1.5Cu釬料合金的潤(rùn)濕性能和力學(xué)性能最好，與基體Bi5Sb相比，(Bi5Sb)1.5Cu的鋪展面積增大57.8%，抗拉強(qiáng)度提高212.4%；隨著Cu含量的增大，針狀組織Cu2Sb的含量逐漸增多，釬料合金性能下降。
關(guān)鍵字: Bi5Sb釬料合金；Cu；潤(rùn)濕性能；力學(xué)性能
（1. College of Material Science and Engineering, Henan University of Science and Technology,
Luoyang 471003, China;
2.Henan Key Laboratory of Advanced Non-ferrous Metals, Henan University of Science and Technology,
Luoyang 471003, China）
Abstract:A new BiSbCu ternary alloy was formed by adding different contents of Cu into Bi5Sb solder alloy to improve its wettability and mechanical properties. The results show the effect of adding 0.5%−5.0% (mass fraction) Cu into Bi5Sb on the melting point of Bi5Sb solder alloy is not distinct, whereas the wettability and mechanical property are remarkably improved. Compared with the Bi5Sb matrix, the spreading area of (Bi5Sb)1.5Cu solder alloy increases 57.8% and the tensile strength increases 212.4% when the content of Cu is 1.5%. The number of needle-like Cu2Sb gradually increases with increasing Cu content, which weakens the properties of the solder alloy.
Key words: Bi5Sb solder alloy; Cu; wettability; mechanical property
