(北京科技大學(xué) 材料科學(xué)與工程學(xué)院，北京 100083)
摘 要: 以Ag-Cu-Ti-TiC復(fù)合釬料為中間層，在適當(dāng)?shù)墓に噮?shù)下真空釬焊Cf/SiC復(fù)合材料與Ti合金。利用SEM、EDS和XRD分析接頭的微觀組織結(jié)構(gòu)，利用剪切實(shí)驗(yàn)檢測(cè)接頭的力學(xué)性能。結(jié)果表明：釬焊時(shí)，借助液態(tài)釬料，復(fù)合釬料中的Ti與Cf/SiC復(fù)合材料反應(yīng)，在Cf/SiC復(fù)合材料與連接層界面形成Ti-Si-C、Ti-Si和少量TiC化合物的混合反應(yīng)層；復(fù)合釬料中的Cu與Ti合金中的Ti發(fā)生互擴(kuò)散，在連接層與Ti合金界面形成不同成分的Cu-Ti化合物過(guò)渡層；釬焊后，形成TiC顆粒強(qiáng)化的致密復(fù)合連接層，TiC的加入降低了接頭的殘余熱應(yīng)力，Cf/SiC/Ag-Cu-Ti-TiC/TC4接頭的剪切強(qiáng)度明顯高于Cf/SiC/Ag-Cu-Ti/TC4接頭的。
關(guān)鍵字: Cf/SiC復(fù)合材料；Ti合金；釬焊；Ag-Cu-Ti-TiC
（School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China）
Abstract:Cf/SiC composite was joined with Ti alloy using Ag-Cu-Ti-TiC mixed powder as interlayer under condition of some suitable brazing parameters. The microstructures of the brazed joint were investigated by SEM, EDS and XRD. The mechanical properties of the brazed joints were measured by mechanical testing machine. The results show that Ti element in the interlayer can react with the brazed composite, a mixture of Ti-Si-C, Ti-Si and TiC composites finally form the reaction layer between the composite and interlayer. Ti alloy constantly dissolves and Cu diffuses into the Ti alloy, the diffusion reaction layers between the interlayer and Ti alloy forms. The performed joints have dense bonding layers reinforced by TiC. These composite brazing layers relax the thermal stress of the joint effectively. These characteristics are beneficial to the joint, of which the shear strength are remarkably higher than the optimal shear strength of the joint brazed with pure Ag-Cu-Ti.
Key words: Cf/SiC composite; Ti alloy; brazing; Ag-Cu-Ti-TiC filler materials
