(中國科學(xué)院半導(dǎo)體研究所， 北京 100083)
摘 要: 由于芯片封裝成器件后頻率響應(yīng)會降低， 介紹了10 Gbit/s系統(tǒng)用的激光器和探測器的封裝技術(shù)來封裝芯片。通過研究發(fā)現(xiàn)， 通過金絲電感可以補償芯片和熱沉的寄生電容， 從而使封裝后的器件頻率響應(yīng)有所改善。 利用此封裝技術(shù)， 實現(xiàn)了3 dB調(diào)制帶寬為10.5 GHz 的TO封裝激光器。 并在此基礎(chǔ)上，研發(fā)了10 Gbit/s Transponder， 且此10 Gbit/s Transponder的測試性能完全滿足MSA和ITU-T規(guī)范， 符合應(yīng)用要求。
關(guān)鍵字: 光通信； 激光器； 封裝； 光收發(fā)模塊； 10Gbit/s
（Institute of Semiconductors , Chinese Academy of Sciences, Beijing 100083, China）
Abstract:Usually, the magnitude of the transmission coefficient of the packaged laser module is lower than that of the laser diode. The packaging techniques for laser diodes and photodiodes for 10 Gbit/s applications was introduced. The results show that the response of the laser module can be superior to that of the laser diode at some frequencies. The improvement was based on the compensation of bonding wire inductance to the parasitic capacitance in both the submount and the laser diode. TO packaging techniques can achieve a frequency bandwidth of over 10.5 GHz for TO laser module, 15.5 GHz for butterfly laser module and 16.5 GHz for TO photodetector. The 10 Gbit/s Transponders was also developed, and the results of measurements show that the transponders can meet the requirements of MSA and ITU-T.
Key words: optical communication; laser diode; photodiode; package; transponder; 10 Gbit/s
