(上海交通大學(xué) 金屬基復(fù)合材料國家重點(diǎn)實(shí)驗(yàn)室， 上海 200030)
摘 要: 采用復(fù)合電鑄工藝制備碳化硅顆粒（SiCp）增強(qiáng)銅基復(fù)合材料， 研究了鍍液中顆粒濃度、 鍍液溫度、 電流密度對v復(fù)合材料中SiCp含量的影響。 通過優(yōu)化各工藝參數(shù)可有效促進(jìn)SiCp與銅的共沉積， 提高復(fù)合材料中增強(qiáng)固體顆粒的含量。 結(jié)果表明： 隨著SiCp含量增加，Cu/SiCp復(fù)合材料的熱膨脹系數(shù)和導(dǎo)熱系數(shù)減小， 抗彎強(qiáng)度和硬度提高。 此外， 復(fù)合電鑄工藝制備的復(fù)合材料具有較大內(nèi)應(yīng)力， 對Cu/SiCp復(fù)合材料的熱膨脹性能和硬度有一定影響。
關(guān)鍵字: 復(fù)合電鑄； 碳化硅顆粒； 銅基復(fù)合材料
DING Wen-jiang
（State Key Laboratory of Metal Matrix Composites,
Shanghai Jiaotong University, Shanghai 200030, China）
Abstract: The SiCp reinforced copper-based composites was prepared by using composite electroforming technology. The influences of the concentration of SiCp in plating solution, the temperature of plating solution, and current density on the SiCp content in Cu/SiCp composites were studied. The results show that through optimizing the technology parameters, it could promote co-deposition of Cu and SiCp effectively and increase SiCp volume content in composites. The results indicate that with increasing SiCp content, CTE (coefficient of thermal expansion) and conductivity factor decrease, but bend strength and HV(Vickers-hardness) increase. Besides, internal stress exist in Cu/SiCp composites fabricated by composite electroforming, which has influences on HV and thermal expansion property of Cu/SiCp composites.
Key words: composite electroforming; SiCp; copper-based composites
