(1. 北京有色金屬研究總院
國(guó)家有色金屬?gòu)?fù)合材料工程技術(shù)研究中心， 北京 100088;
2. 北京科技大學(xué) 新金屬材料國(guó)家重點(diǎn)實(shí)驗(yàn)室， 北京 100085)
摘 要: 利用噴射成形技術(shù)制備了60Si40Al合金新型電子封裝材料。 研究了各工藝參數(shù)對(duì)沉積坯件的影響， 確定了較佳工藝參數(shù)。 研究了材料的顯微組織以及沉積態(tài)合金在加熱保溫過(guò)程中的組織轉(zhuǎn)變規(guī)律， 確定了熱等靜壓溫度， 進(jìn)行了熱等靜壓致密化處理。 研究結(jié)果表明： 材料顯微組織細(xì)小， 一次硅相尺寸約為10μm， 且均勻彌散分布， 該材料的熱膨脹系數(shù)為9×10-6~10×10-6/K， 熱導(dǎo)率約為110W/(m·K)， 是一種理想的電子封裝材料。
關(guān)鍵字: 噴射成形; 60Si40Al合金; 封裝材料; 熱等靜壓
SHI Li-kai1, ZHANG Ji-shan2, CHEN Mei-ying2
（ 1. National Engineering & Technology Research Center for Nonferrous MMCs,
Beijing General Research Institute for Nonferrous Metals, Beijing 100088, China;
2. State Key Laboratory for Advanced Metals and Materials,
University of Science and Technology Beijing,
Beijing 100085, China）
Abstract: A novel 60Si40Al alloy packaging material for electronic applications was prepared by spray forming technology. The effect of parameter upon performs, the microstructures produced from spray forming process, and the hot isostatic pressing(HIP) process were studied. The results show that Si phase is fine and dispersion, the microstructure of performs from spray forming is fine and uniform, the thermal expansivity(CTE) is about 9×10-6~10×10-6/K, and the thermal conductivity is about 110W/(m·K).
Key words: spray forming; 60Si40Al alloy; packaging material; HIP
