Cu6Sn5的生長(zhǎng)動(dòng)力學(xué)
(1. 河南科技大學(xué) 材料科學(xué)與工程學(xué)院，洛陽(yáng) 471003；
2. 河南省有色金屬材料科學(xué)與加工技術(shù)重點(diǎn)實(shí)驗(yàn)室，洛陽(yáng) 471003)
摘 要: 利用X射線衍射分析儀、JSM-5610LV掃描電鏡及能譜分析研究釬焊和時(shí)效過(guò)程中低銀Sn-2.5Ag- 0.7Cu(0.1RE)/Cu焊點(diǎn)界面區(qū)顯微組織和Cu6Sn5金屬間化合物的生長(zhǎng)行為。結(jié)果表明：釬焊過(guò)程中焊點(diǎn)界面區(qū)Cu6Sn5金屬間化合物的厚度是溶解和生長(zhǎng)兩方面共同作用的結(jié)果；隨著時(shí)效時(shí)間的延長(zhǎng)，焊點(diǎn)界面區(qū)Cu6Sn5的形貌由扇貝狀轉(zhuǎn)變?yōu)閷訝睿溟L(zhǎng)大動(dòng)力學(xué)符合拋物線規(guī)律，由擴(kuò)散機(jī)制控制；添加0.1%稀土元素能有效減慢界面Cu6Sn5金屬間化合物在釬焊及時(shí)效過(guò)程中的長(zhǎng)大速度，可改變焊點(diǎn)裂紋的起源位置，提高其可靠性。
關(guān)鍵字: Sn-2.5Ag-0.7Cu(0.1RE)釬料；Cu6Sn5；釬焊；時(shí)效；微觀組織；長(zhǎng)大動(dòng)力學(xué)
Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface
（1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China;
2. The Key Laboratory of Non-ferrous Materials Science and Processing Technic of Henan Province,
Luoyang 471003, China）
Abstract: The microstructure and growth behavior of Cu6Sn5 intermetallic compound (IMC) of low Ag content Sn-2.5Ag-0.7Cu(0.1RE)/Cu solder joint interface were investigated by using the X-ray diffraction, JSM-5610LV scanning electronic microscope and energy spectrum analysis. The results show that the Cu6Sn5 thickness of the solder joint interface is decided by its diffraction and growing during the soldering. With the aging time increasing, the Cu6Sn5 micrograph of the solder joint interface can be changed from the scallop-like to the shape-layer, and the growing dynamics is coincidence with the law of parabola and its growing behavior is controlled by diffusion. With adding tiny rare earth(0.1RE) in the Sn-2.5Ag-0.7Cu solder alloy, the Cu6Sn5 growing rate of the solder joint can be effectively reduced during the soldering and aging period, and the crack initiation place can be changed, so the reliability of the solder joint can be greatly improved.
Key words: Sn-2.5Ag-0.7Cu(0.1 RE) solder alloy; Cu6Sn5; soldering; aging; microstructure; growing dynamics
