(南京航空航天大學(xué) 機(jī)電工程學(xué)院, 南京 210016)
摘 要: 在銅的電鑄過程中， 通過陶瓷微珠等硬質(zhì)粒子摩擦和擾動電鑄層表面來改善電鑄層的質(zhì)量。 對所制備的銅電鑄層的表面形貌、 織構(gòu)等微觀結(jié)構(gòu)和顯微硬度、 抗腐蝕等性能進(jìn)行測試和分析， 并與傳統(tǒng)方法所制備的銅電鑄層相比較。 結(jié)果表明： 硬質(zhì)粒子在電鑄過程中對電鑄層表面的摩擦和擾動具有顯著的除瘤和整平作用， 使所制備的銅電鑄層外觀光亮平整， 顯著改變其微觀結(jié)構(gòu)和性能； 銅電鑄層各晶面的衍射強(qiáng)度降低， (200)晶面的擇優(yōu)程度減小， (111)晶面的擇優(yōu)程度增大； 顯微硬度值由HV156增至HV221； 抗腐蝕性能顯著提高， 在NaCl溶液中的腐蝕速率降低了20％。
關(guān)鍵字: 銅； 硬質(zhì)粒子； 電鑄； 電沉積； 結(jié)構(gòu)； 性能
electroformed copper
（School of Mechanical and Electrical Engineering, Nanjing University of Aeronaustics and Astronaustics, Nanjing 210016, China）
Abstract: During the electroforming process of copper, the quality of electrodes was improved through polishing and perturbation of hard particles. The morphology and texture of the deposits were studied in contrast with that of the deposits obtained by traditional methods. The values of microhardness and corrosion rate in NaCl solution were also measured. The results show that the polishing of hard particles can effectively remove nodules and level the deposit, which leads to a brightening and smoothing deposition. Due to the perturbing of hard particles, the microstructure and property significantly change. The intensity of X-ray diffraction reduces, the degree of (200) preferential orientation decreases and that of (111) preferential orientation increases. The microhardness evidently increases from HV156 to HV221 and the corrosion resistance is improved by 20% in NaCl solution.
Key words: copper; hard particle; electroformation; electrodeposition; structure; property
