( 1. 桂林電子工業(yè)學院 信息材料科學與工程系，桂林 541004；
2. 中南大學 材料科學與工程學院， 長沙 410083)
摘 要: 采用電子陶瓷工藝制備了一系列玻璃/鍶長石陶瓷復合材料， 并對復合材料進行X射線衍射分析、 掃描電鏡觀察和性能測試。 結(jié)果表明： 復合材料的介電常數(shù)、 熱膨脹系數(shù)和顯微硬度隨著鍶長石含量的增加而增加， 而介電損耗隨鍶長石含量的增加而減小。 鍶長石含量大于50%(質(zhì)量分數(shù))的復合材料中α石英和方石英的析出增加了材料的熱膨脹系數(shù)， 但對材料的介電性能影響不大。 所制備的復合材料具有低的介電常數(shù)(5.2～5.8)、 低的介電損耗(0.10%～0.25%)、 低的熱膨脹系數(shù)(4.4×10-6～6.2×10-6 ℃-1)和低的燒結(jié)溫度(≤900 ℃)， 有望用于電子封裝領(lǐng)域。
關(guān)鍵字: 玻璃/陶瓷復合材料； 鍶長石； 燒結(jié)； 微結(jié)構(gòu)
（ 1. Department of Information Materials Science and Engineering,
Guilin University of Electronic Technology, Guilin 541004, China;
2. School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract: A series of glass/ceramic composites were prepared using electronic ceramics process from borosilicate glass with Sr-celsian, which contains 30%, 40%, 50%, 60%, 70%(mass fraction) ceramic. The phase and microstructural evolution of the composites were characterized by X-ray diffractrometry and scanning electron microscope. The properties of the composites were also measured. The results show that the thermal expansion coefficient, dielectric constant and hardness of the composites increase with the increase of Sr-celsian content. However, the dielectric loss decreases with increasing Sr-celsian content. The formation of α-quartz and cristobalite in the composites containing above 50% ceramic content during the sintering process has bad effect on thermal expansion behaviour, but has little effect on the values of dielectric properties of the composites. The obtained composites exhibit low dielectric constant(5.2-5.8), low dielectric loss(≤0.25%), low thermal expansion coefficient (4.4×10-6-6.2×10-6 ℃-1) and low-temperature sintering behavior (≤900 ℃), which suits for electronic packaging field.
Key words: glass/ceramic composites; Sr-celsian; sintering; microstructure
