(吉林大學 材料科學與工程學院, 長春 130025)
摘 要: 研究了Bi、 Ag對Sn-9Zn無鉛釬料系統(tǒng)潤濕性、 接頭力學性能及微觀組織的影響。 結(jié)果表明： Sn-9Zn無鉛釬料的潤濕性較差， 添加適量的Bi有助于提高釬料的潤濕性和接頭剪切強度， 但同時也使接頭的塑性降低； 添加適量的Ag能明顯改善釬料的潤濕性和接頭塑性， 但Ag的質(zhì)量分數(shù)超過1.5％時會降低釬料潤濕性和接頭剪切強度。 Sn-9Zn-Bi系無鉛釬料組織由富Sn相、 富Zn相及Bi的析出物組成； Sn-9Zn-Ag系無鉛釬料組織由富Sn相、 富Zn相及AgZn3化合物組成。
關(guān)鍵字: Sn-Zn無鉛釬料； 微觀組織； 潤濕性能； 力學性能
（ School of Materials Science and Engineering, Jilin University,
Changchun 130025, China）
Abstract: The influences of the addition of Bi, Ag to Sn-9Zn lead-free solder on the microstructure, wettability and mechanical properties were studied. The results show that Sn-9Zn lead-free solder has poor wettability. With the addition of Bi to Sn-9Zn lead-free solder, the improvement of wettability and shearing strength of joint can be achieved, but plasticity of joint decreases. With the addition of suitable amount Ag to Sn-9Zn lead-free solder, the improvement of wettability and plasticity of joint can be achieved obviously. With the addition of up to 1.5%Ag(mass fraction) to Sn-9Zn lead-free solder, the wettability and shearing strength of joint decreases. The micro-structures of Sn-9Zn-Bi solder system are composed of β-Sn matrix, Zn-rich phase and the precipitation of Bi phase in the β-Sn matrix. The microstructures of Sn-9Zn-Ag solder system are composed of β-Sn matrix, Zn-rich phase and AgZn3 intermetallic compound.
Key words: Sn-Zn lead-free solder; microstructure; wettability; mechanical properties
